JAJSEP3C September   2017  – March 2018 LMZM33603

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
    1.     概略回路図
  3. 3 概要
    1.     安全動作領域
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics (VIN = 5 V)
    8. 6.8 Typical Characteristics (VIN = 12 V)
    9. 6.9 Typical Characteristics (VIN = 24 V)
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Adjusting the Output Voltage
      2. 7.3.2  Feed-Forward Capacitor, CFF
      3. 7.3.3  Output Current vs Output Voltage
      4. 7.3.4  Voltage Dropout
      5. 7.3.5  Switching Frequency (RT)
      6. 7.3.6  Synchronization (SYNC)
      7. 7.3.7  Input Capacitors
      8. 7.3.8  Output Capacitors
      9. 7.3.9  Output On/Off Enable (EN)
      10. 7.3.10 Programmable Undervoltage Lockout (UVLO)
      11. 7.3.11 Power Good (PGOOD)
      12. 7.3.12 Overcurrent Protection (OCP)
      13. 7.3.13 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Active Mode
      2. 7.4.2 Shutdown Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Output Voltage Setpoint
        3. 8.2.2.3 Feed-Forward Capacitor (CFF)
        4. 8.2.2.4 Setting the Switching Frequency
        5. 8.2.2.5 Input Capacitors
        6. 8.2.2.6 Output Capacitor Selection
        7. 8.2.2.7 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 Theta JA vs PCB Area
    4. 10.4 EMI
      1. 10.4.1 EMI Plots
    5. 10.5 Package Specifications
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 デバイス・サポート
      1. 11.1.1 デベロッパー・ネットワークの製品に関する免責事項
      2. 11.1.2 WEBENCH®ツールによるカスタム設計
    2. 11.2 関連資料
    3. 11.3 ドキュメントの更新通知を受け取る方法
    4. 11.4 コミュニティ・リソース
    5. 11.5 商標
    6. 11.6 静電気放電に関する注意事項
    7. 11.7 Glossary
  12. 12メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1) LMZM33603 UNIT
RLR (QFN)
18 PINS
RθJA Junction-to-ambient thermal resistance (2) 18.9 °C/W
ψJT Junction-to-top characterization parameter (3) 2.0 °C/W
ψJB Junction-to-board characterization parameter (4) 6.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance, RθJA, applies to devices soldered directly to a 63 mm x 63 mm, 4-layer PCB with 2 oz. copper and natural convection cooling. Additional airflow reduces RθJA.
(3) The junction-to-top board characterization parameter, ψJT, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (section 6 and 7). TJ = ψJT × Pdis + TT; where Pdis is the power dissipated in the device and TT is the temperature of the top of the device.
(4) The junction-to-board characterization parameter, ψJB, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (sections 6 and 7). TJ = ψJB × Pdis + TB; where Pdis is the power dissipated in the device and TB is the temperature of the board 1mm from the device.