JAJSSB5H July   2004  – December 2023 LP2981 , LP2981A

PRODUCTION DATA  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Output Enable
      2. 6.3.2 Dropout Voltage
      3. 6.3.3 Current Limit
      4. 6.3.4 Undervoltage Lockout (UVLO)
      5. 6.3.5 Thermal Shutdown
      6. 6.3.6 Output Pulldown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Device Functional Mode Comparison
      2. 6.4.2 Normal Operation
      3. 6.4.3 Dropout Operation
      4. 6.4.4 Disabled
  8. Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Recommended Capacitor Types
        1. 7.1.1.1 Recommended Capacitors for the Legacy Chip
          1. 7.1.1.1.1 Tantalum Capacitors
          2. 7.1.1.1.2 Ceramic Capacitors
          3. 7.1.1.1.3 Aluminum Capacitors
        2. 7.1.1.2 Recommended Capacitors for the New Chip
      2. 7.1.2 Input and Output Capacitor Requirements
        1. 7.1.2.1 Input Capacitor
        2. 7.1.2.2 Output Capacitor
      3. 7.1.3 Estimating Junction Temperature
      4. 7.1.4 Power Dissipation (PD)
      5. 7.1.5 Reverse Current
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 ON and OFF Input Operation
      3. 7.2.3 Application Curves
  9. Power Supply Recommendations
  10. Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 サポート・リソース
    5. 10.5 Trademarks
    6. 10.6 静電気放電に関する注意事項
    7. 10.7 用語集
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Typical Characteristics

Unless otherwise specified: TA = 25°C, VIN = VO(NOM) + 1 V, COUT = 10 µF, CIN = 1 µF all voltage options, ON/ OFF pin tied to VIN.

GUID-FAA679C5-CFAB-476C-A307-DB7E51B5E091-low.gif
VIN = 4.3 V, VOUT = 3.3 V
Figure 5-1 Output Voltage vs Load Current (Legacy Chip)
GUID-20231126-SS0I-PMB9-DZJC-B7CHZC3VPW6J-low.svg
VIN = 4.3 V, VOUT = 3.3 V
Figure 5-3 Load Regulation vs Temperature (New Chip)
GUID-20231125-SS0I-CN2F-NCHJ-Q1PQFQPLRLKT-low.svg
VOUT = 3.3 V
Figure 5-5 Output Voltage vs VIN (New Chip)
GUID-20231125-SS0I-C2MR-B8H0-WW3SW7LS6KZT-low.svg
VOUT = 3.3 V, IL = 1 mA
Figure 5-7 Line Regulation vs VIN and Temperature (New Chip)
GUID-20231125-SS0I-Z33Z-BM64-G3DLT1MHNZH2-low.svg
Figure 5-9 Dropout Voltage (VDO) vs Load Current (New Chip)
GUID-20231125-SS0I-0QN0-TKQB-Z90PCZKNNDL1-low.svg
Figure 5-11 Ground Pin Current (IGND) vs Load Current (New Chip)
GUID-20231203-SS0I-SX1H-KLJ1-WKBNBDFXK7J9-low.svg
VOUT = 3.3 V, IL = 100 mA
Figure 5-13 Line Transient Response (New Chip)
GUID-20231125-SS0I-9RVB-XJLQ-43DK3B88T3LM-low.svg
VOUT = 3.3 V, COUT = 2.2 μF
Figure 5-15 Load Transient Response (New Chip)
GUID-20231125-SS0I-QJSP-XHBN-LFTJKMKGNRPM-low.svg
VIN = 16.0 V
Figure 5-17 Short Circuit Current vs Time (New Chip)
GUID-20221126-SS0I-FLNQ-FPBB-JBNSFTBXGNSS-low.svg
Figure 5-19 Short Circuit Current vs Output Voltage (VOUT) (New Chip)
GUID-20231125-SS0I-RGJT-MNKF-D8MJRXBJBFWC-low.svg
Figure 5-21 Ripple Rejection vs Output Capacitor (CL) and Frequency (New Chip)
GUID-20231125-SS0I-ZHCM-HWLT-WSW4J55CKTQB-low.svg
Figure 5-23 Output Noise Density vs Output Capacitor (CL) Frequency (New Chip)
GUID-20231125-SS0I-37DK-VDB0-LKN3QRVMTSLL-low.svg
VOUT = 3.3 V, RL = 3.3 kΩ
Figure 5-25 Turn-on Waveform (New Chip)
GUID-20231125-SS0I-DJFT-CTS3-P9G2Z9HFP7H3-low.svg
VIN = 4.3 V
Figure 5-27 ON/ OFF Pin Current vs VON/ OFF (New Chip)
GUID-20231125-SS0I-D1T0-GHZ8-N7CTML9JV1Q9-low.svg
Figure 5-29 ON/ OFF Threshold vs Temperature (New Chip)
GUID-20231126-SS0I-HMDV-DG6X-DWDG4J62Q0MH-low.svg
VIN = 4.3 V, VOUT = 3.3 V
Figure 5-2 Output Voltage vs Load Current (New Chip)
GUID-20231125-SS0I-G9GL-ZP2T-TX1H73GRP4RX-low.svg
VIN = 4.3 V, VOUT = 3.3 V
Figure 5-4 Output Voltage vs Temperature (New Chip)
GUID-20231203-SS0I-NDPD-KM9W-LXPG2QXZPXDM-low.svg
VOUT = 3.3 V, IL = 1 mA
Figure 5-6 Output Voltage vs VIN and Temperature (New Chip)
GUID-20231125-SS0I-VSQP-FQNP-PZGGFBP5BGGQ-low.svg
Figure 5-8 Dropout Voltage (VDO) vs Temperature (New Chip)
GUID-20231203-SS0I-CZHF-QGSB-TLTR1L1T4ZT6-low.svg
Figure 5-10 Ground Pin Current (IGND) vs Temperature (New Chip)
GUID-20231203-SS0I-JRBB-2HZM-MVLZLZHJTN8G-low.svg
VOUT = 3.3 V, RL = 3.3 kΩ
Figure 5-12 Input Current vs Input Voltage (VIN) (New Chip)
GUID-20231203-SS0I-WTMH-J9VM-P3BW6DMJJ48C-low.svg
VOUT = 3.3 V, IL = 1 mA
Figure 5-14 Line Transient Response (New Chip)
GUID-20231125-SS0I-Z01T-FXGX-B7MZ5C7FGZLR-low.svg
VIN = 6.0 V
Figure 5-16 Short Circuit Current vs Time (New Chip)
GUID-20231203-SS0I-ND4M-TNGH-1HTC9S3HVJJN-low.svg
Figure 5-18 Instantaneous Short Circuit Current vs Temperature (New Chip)
GUID-20231125-SS0I-GLSW-XG24-6WMLZXCJ2PBM-low.svg
Figure 5-20 Ripple Rejection vs Load Current (IL) and Frequency (New Chip)
GUID-20231125-SS0I-9DRC-3HGD-TCKKHMQ98XRT-low.svg
Figure 5-22 Output Noise Density vs Load Current (IL) Frequency (New Chip)
GUID-20231203-SS0I-SF7M-8CDN-FH6JKNWLD3DX-low.svg
Figure 5-24 Output Reverse Leakage vs Temperature (New Chip)
GUID-20231203-SS0I-2MBB-KD6J-XNSCBWRFWGRC-low.svg
VOUT = 5 V, RL = 5 kΩ
Figure 5-26 Turn-off Waveform (New Chip)
GUID-20231125-SS0I-L8CN-SRJC-K0LTB7R1RPHW-low.svg
VIN = 16.0 V
Figure 5-28 ON/ OFF Pin Current vs VON/ OFF (New Chip)