JAJSO71 March   2022 LP8764-Q1

PRODUCTION DATA  

  1. 特長
  2. アプリケーション
  3. 説明
  4. Revision History
  5. Pin Configuration and Functions
    1. 5.1 Digital Signal Descriptions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Internal Low Drop-Out Regulators (LDOVINT)
    6. 6.6  BUCK1, BUCK2, BUCK3, and BUCK4 Regulators
    7. 6.7  Reference Generator (REFOUT)
    8. 6.8  Monitoring Functions
    9. 6.9  Clocks, Oscillators, and DPLL
    10. 6.10 Thermal Monitoring and Shutdown
    11. 6.11 System Control Thresholds
    12. 6.12 Current Consumption
    13. 6.13 Digital Input Signal Parameters
    14. 6.14 Digital Output Signal Parameters
    15. 6.15 I/O Pullup and Pulldown Resistance
    16. 6.16 I2C Interface
    17. 6.17 Serial Peripheral Interface (SPI)
      1.      25
  7. Typical Characteristics
  8. Detailed Description
    1. 8.1  Overview
    2. 8.2  Functional Block Diagram
    3. 8.3  Input Voltage Monitor
    4. 8.4  Device State Machine
      1. 8.4.1 Fixed Device Power FSM
        1. 8.4.1.1 Register Resets and EEPROM read at INIT state
      2. 8.4.2 Pre-Configurable Mission States
        1. 8.4.2.1 PFSM Commands
          1. 8.4.2.1.1  REG_WRITE_IMM Command
          2. 8.4.2.1.2  REG_WRITE_MASK_IMM Command
          3. 8.4.2.1.3  REG_WRITE_MASK_PAGE0_IMM Command
          4. 8.4.2.1.4  REG_WRITE_BIT_PAGE0_IMM Command
          5. 8.4.2.1.5  REG_WRITE_WIN_PAGE0_IMM Command
          6. 8.4.2.1.6  REG_WRITE_VOUT_IMM Command
          7. 8.4.2.1.7  REG_WRITE_VCTRL_IMM Command
          8. 8.4.2.1.8  REG_WRITE_MASK_SREG Command
          9. 8.4.2.1.9  SREG_READ_REG Command
          10. 8.4.2.1.10 SREG_WRITE_IMM Command
          11. 8.4.2.1.11 WAIT Command
          12. 8.4.2.1.12 DELAY_IMM Command
          13. 8.4.2.1.13 DELAY_SREG Command
          14. 8.4.2.1.14 TRIG_SET Command
          15. 8.4.2.1.15 TRIG_MASK Command
          16. 8.4.2.1.16 END Command
        2. 8.4.2.2 Configuration Memory Organization and Sequence Execution
        3. 8.4.2.3 Mission State Configuration
        4. 8.4.2.4 Pre-Configured Hardware Transitions
          1. 8.4.2.4.1 ON Requests
          2. 8.4.2.4.2 OFF Requests
            1. 8.4.2.4.2.1 NSLEEP1 and NSLEEP2 Functions
            2. 8.4.2.4.2.2 WKUP1 and WKUP2 Functions
      3. 8.4.3 Error Handling Operations
        1. 8.4.3.1 Power Rail Output Error
        2. 8.4.3.2 Boot BIST Error
        3. 8.4.3.3 Runtime BIST Error
        4. 8.4.3.4 Catastrophic Error
        5. 8.4.3.5 Watchdog (WDOG) Error
        6. 8.4.3.6 Error Signal Monitor (ESM) Error
        7. 8.4.3.7 Warnings
      4. 8.4.4 Device Start-up Timing
      5. 8.4.5 Power Sequences
      6. 8.4.6 First Supply Detection
    5. 8.5  Power Resources
      1. 8.5.1 Buck Regulators
        1. 8.5.1.1 BUCK Regulator Overview
        2. 8.5.1.2 Multi-Phase Operation and Phase-Adding or Shedding
        3. 8.5.1.3 Transition Between PWM and PFM Modes
        4. 8.5.1.4 Spread-Spectrum Mode
        5. 8.5.1.5 Adaptive Voltage Scaling (AVS) and Dynamic Voltage Scaling (DVS) Support
        6. 8.5.1.6 BUCK Output Voltage Setting
      2. 8.5.2 Sync Clock Functionality
      3. 8.5.3 Internal Low Dropout Regulator (LDOVINT)
    6. 8.6  Residual Voltage Checking
    7. 8.7  Output Voltage Monitor and PGOOD Generation
    8. 8.8  General-Purpose I/Os (GPIO Pins)
    9. 8.9  Thermal Monitoring
      1. 8.9.1 Thermal Warning Function
      2. 8.9.2 Thermal Shutdown
    10. 8.10 Interrupts
    11. 8.11 Control Interfaces
      1. 8.11.1 CRC Calculation for I2C and SPI Interface Protocols
      2. 8.11.2 I2C-Compatible Interface
        1. 8.11.2.1 Data Validity
        2. 8.11.2.2 Start and Stop Conditions
        3. 8.11.2.3 Transferring Data
        4. 8.11.2.4 Auto-Increment Feature
      3. 8.11.3 Serial Peripheral Interface (SPI)
    12. 8.12 Multi-PMIC Synchronization
      1. 8.12.1 SPMI Interface System Setup
      2. 8.12.2 Transmission Protocol and CRC
        1. 8.12.2.1 Operation with Transmission Errors
        2. 8.12.2.2 Transmitted Information
      3. 8.12.3 SPMI Target Device Communication to SPMI Controller Device
        1. 8.12.3.1 Incomplete Communication from SPMI Target Device to SPMI Controller Device
      4. 8.12.4 SPMI-BIST Overview
        1. 8.12.4.1 SPMI Bus during Boot BIST and RUNTIME BIST
        2. 8.12.4.2 Periodic Checking of the SPMI
        3. 8.12.4.3 SPMI Message Priorities
    13. 8.13 NVM Configurable Registers
      1. 8.13.1 Register Page Partitioning
      2. 8.13.2 CRC Protection for Configuration, Control, and Test Registers
      3. 8.13.3 CRC Protection for User Registers
      4. 8.13.4 Register Write Protection
        1. 8.13.4.1 ESM and WDOG Configuration Registers
        2. 8.13.4.2 User Registers
    14. 8.14 Watchdog (WD)
      1. 8.14.1 Watchdog Fail Counter and Status
      2. 8.14.2 Watchdog Start-Up and Configuration
      3. 8.14.3 MCU to Watchdog Synchronization
      4. 8.14.4 Watchdog Disable Function
      5. 8.14.5 Watchdog Sequence
      6. 8.14.6 Watchdog Trigger Mode
      7. 8.14.7 WatchDog Flow Chart and Timing Diagrams in Trigger Mode
      8.      121
      9. 8.14.8 Watchdog Question-Answer Mode
        1. 8.14.8.1 Watchdog Q&A Related Definitions
        2. 8.14.8.2 Question Generation
        3. 8.14.8.3 Answer Comparison
          1. 8.14.8.3.1 Sequence of the 2-bit Watchdog Answer Counter
          2. 8.14.8.3.2 Watchdog Sequence Events and Status Updates
          3. 8.14.8.3.3 Watchdog Q&A Sequence Scenarios
    15. 8.15 Error Signal Monitor (ESM)
      1. 8.15.1 ESM Error-Handling Procedure
      2. 8.15.2 Level Mode
      3.      132
      4. 8.15.3 PWM Mode
        1. 8.15.3.1 Good-Events and Bad-Events
        2. 8.15.3.2 ESM Error-Counter
          1. 8.15.3.2.1 ESM Start-Up in PWM Mode
        3. 8.15.3.3 ESM Flow Chart and Timing Diagrams in PWM Mode
        4.       138
    16. 8.16 Register Map
      1. 8.16.1 LP8764x_map Registers
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Buck Inductor Selection
        2. 9.2.1.2 Buck Input Capacitor Selection
        3. 9.2.1.3 Buck Output Capacitor Selection
        4. 9.2.1.4 LDO Output Capacitor Selection
        5. 9.2.1.5 VCCA Supply Filtering Components
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Voltage Scaling Precautions
      4. 9.2.4 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 サポート・リソース
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
  • RQK|32
サーマルパッド・メカニカル・データ
発注情報

特長

  • 下記内容で AEC-Q100 認定済み:
    • 入力電圧:2.8 V~5.5V
    • デバイス温度グレード 1:–40℃~+125℃の動作時周囲温度範囲
    • デバイス HBM ESD 分類レベル 2
    • デバイス CDM ESD 分類レベル C4B
  • 機能安全準拠
    • 機能安全アプリケーション向けに開発
    • ASIL-D までの ISO 26262 システムの設計に役立つ資料を提供
    • SIL-3 までの IEC 61508 システムの設計に役立つ資料を提供
    • ASIL-D までの決定論的能力
    • ASIL-D までのハードウェア安全度
    • 電圧および過電流のウィンドウ・モニタ
    • トリガ / Q&A モードを選択可能なウォッチドッグ
    • レベルまたは PWM エラー信号モニタ (ESM)
    • 温度監視と高温警告およびサーマル・シャットダウン
    • 構成レジスタと不揮発性メモリ (NVM) のビット整合性 (CRC) エラー検出
  • 4 つの高効率降圧 DC/DC コンバータ:
    • 出力電圧:0.3V~3.34V (多相出力で 0.3V~1.9V)
    • 最大出力電流:1 相あたり 5A、4 相構成で最大 20A
    • 出力電圧のスルーレートをプログラム可能:0.5mV/µs~33mV/µs
    • スイッチング周波数:2.2MHz または 4.4MHz
  • 構成可能な 10 個の汎用 I/O (GPIO)
  • マルチ PMIC 同期用 SPMI インターフェイス
  • 入力過電圧保護 (OVP) および低電圧誤動作防止 (UVLO)

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