JAJSQD0O october   1995  – july 2023 SN54AHCT32 , SN74AHCT32

PRODUCTION DATA  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Noise Characteristics
    8. 6.8 Operating Characteristics
    9. 6.9 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 ドキュメントの更新通知を受け取る方法
    2. 10.2 サポート・リソース
    3. 10.3 Trademarks
    4. 10.4 静電気放電に関する注意事項
    5. 10.5 用語集
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Thermal Information

THERMAL METRIC(1)SN74AHCT32UNIT
DDBDGVNNSPWRGYBQA
14 PINS
RθJAJunction-to-ambient thermal resistance97.5109.5133.359.792.2147.759.0

88.3

°C/W
RθJC(top)Junction-to-case (top) thermal resistance58.762.155.647.349.877.472.5

90.9

RθJBJunction-to-board thermal resistance51.856.966.339.551.090.935.0

56.8

ψJTJunction-to-top characterization parameter22.622.67.832.415.727.23.9

9.9

ψJBJunction-to-board characterization parameter51.656.356.639.450.690.235.1

56.7

RθJC(bot)Junction-to-case (bottom) thermal resistance15.4

33.4

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).