JAJSGT6L December   1997  – August 2022 SN74CBTLV3126

PRODUCTION DATA  

  1. 特長
  2. アプリケーション
  3. 概要
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Function Table (Each Bus Switch)
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Protocol and Signal Isolation
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 サポート・リソース
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ(パッケージ|ピン)
  • D|14
  • DBQ|16
  • RGY|14
  • PW|14
  • DGV|14
サーマルパッド・メカニカル・データ
発注情報

Thermal Information

THERMAL METRIC(1)SN74CBTLV3126UNIT
D
(SOIC)
DGV
(TVSOP)
PW
(TSSOP)
RGY
(VQFN)
DBQ
(SSOP)
14 PINS14 PINS14 PINS14 PINS16 Pins
RθJAJunction-to-ambient thermal resistance100.6154.8123.359.6118.7°C/W
RθJC(top)Junction-to-case (top) thermal resistance55.564.553.071.366.4°C/W
RθJBJunction-to-board thermal resistance56.888.466.335.662.2°C/W
ΨJTJunction-to-top characterization parameter17.011.19.34.220.9°C/W
ΨJBJunction-to-board characterization parameter56.487.465.735.761.7°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/AN/AN/A16.1N/A°C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.