JAJSON1H March   2003  – August 2023 SN54HCT244 , SN74HCT244

PRODUCTION DATA  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics - SN54HCT244
    6. 6.6  Electrical Characteristics - SN74HCT244
    7. 6.7  Switching Characteristics: SN54HCT244
    8. 6.8  Switching Characteristics: SN74HCT244
    9. 6.9  Operating Characteristics
    10. 6.10 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 ドキュメントの更新通知を受け取る方法
    3. 10.3 サポート・リソース
    4. 10.4 Trademarks
    5. 10.5 静電気放電に関する注意事項
    6. 10.6 用語集
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ(パッケージ|ピン)
  • DB|20
  • NS|20
  • N|20
  • DW|20
  • PW|20
  • DGS|20
サーマルパッド・メカニカル・データ
発注情報

Thermal Information

THERMAL METRICSN74HCT244UNIT
DW (SOIC)DB (SSOP)N (PDIP)NS (SO)PW (TSSOP)DGS (VSSOP)
20 PINS20 PINS20 PINS20 PINS20 PINS20 PINS
RθJAJunction-to-ambient thermal resistance(1)109.1122.784.6113.4131.8130.6°C/W
RθJC (top)Junction-to-case (top) thermal resistance7681.672.578.672.268.7°C/W
RθJBJunction-to-board thermal resistance77.677.565.378.482.885.4°C/W
ΨJTJunction-to-top characterization parameter51.546.155.347.121.510.5°C/W
ΨJBJunction-to-board characterization parameter77.177.165.278.182.485.0°C/W
RθJC (bot)Junction-to-case (bottom) thermal resistanceN/AN/AN/AN/AN/AN/A°C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.