JAJST10A February   2024  – March 2024 SN74LVC7001A-Q1

PRODUCTION DATA  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Noise Characteristics
    8. 5.8 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS Push-Pull Outputs
      2. 7.3.2 CMOS Schmitt-Trigger Inputs
      3. 7.3.3 Clamp Diode Structure
      4. 7.3.4 Wettable Flanks
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 ドキュメントの更新通知を受け取る方法
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ(パッケージ|ピン)
  • PW|14
  • BQA|14
サーマルパッド・メカニカル・データ
発注情報

Pin Configuration and Functions

GUID-20240122-CA0I-TDMD-WPPS-ZMKGRLFQ6S6K-low.svgFigure 4-1 BQA Package, 14 Pin WQFN (Top View)
GUID-37D0F917-BEE9-409E-A457-95799B98378F-low.gifFigure 4-2 PW Package, 14 Pin TSSOP (Top View)
Table 4-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
1A 1 I Channel 1, Input A
1B 2 I Channel 1, Input B
1Y 3 O Channel 1, Output Y
2A 4 I Channel 2, Input A
2B 5 I Channel 2, Input B
2Y 6 O Channel 2, Output Y
GND 7 Ground
3Y 8 O Channel 3, Output Y
3A 9 I Channel 3, Input A
3B 10 I Channel 3, Input B
4Y 11 O Channel 4, Output Y
4A 12 I Channel 4, Input A
4B 13 I Channel 4, Input B
VCC 14 Positive Supply
Thermal Information(2) The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply.
I = input, O = output
For BQA package only.