SLASF38 December   2023 TAD5212-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements: I2C Interface
    7. 6.7  Switching Characteristics: I2C Interface
    8. 6.8  Timing Requirements: SPI Interface
    9. 6.9  Switching Characteristics: SPI Interface
    10. 6.10 Timing Requirements: TDM, I2S or LJ Interface
    11. 6.11 Switching Characteristics: TDM, I2S or LJ Interface
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Serial Interfaces
        1. 7.3.1.1 Control Serial Interfaces
        2. 7.3.1.2 Audio Serial Interfaces
          1. 7.3.1.2.1 Time Division Multiplexed Audio (TDM) Interface
          2. 7.3.1.2.2 Inter IC Sound (I2S) Interface
          3. 7.3.1.2.3 Left-Justified (LJ) Interface
        3. 7.3.1.3 Using Multiple Devices With Shared Buses
        4. 7.3.1.4 Phase-Locked Loop (PLL) and Clock Generation
        5. 7.3.1.5 Output Channel Configurations
        6. 7.3.1.6 Reference Voltage
        7. 7.3.1.7 Programmable Microphone Bias
        8. 7.3.1.8 Signal-Chain Processing
          1. 7.3.1.8.1 DAC Signal-Chain
            1. 7.3.1.8.1.1 Programmable Channel Gain and Digital Volume Control
            2. 7.3.1.8.1.2 Programmable Channel Gain Calibration
            3. 7.3.1.8.1.3 Programmable Digital High-Pass Filter
            4. 7.3.1.8.1.4 Programmable Digital Biquad Filters
            5. 7.3.1.8.1.5 Programmable Digital Mixer
            6. 7.3.1.8.1.6 Configurable Digital Interpolation Filters
              1. 7.3.1.8.1.6.1 Linear Phase Filters
                1. 7.3.1.8.1.6.1.1 Sampling Rate: 16 kHz or 14.7 kHz
                2. 7.3.1.8.1.6.1.2 Sampling Rate: 24 kHz or 22.05 kHz
                3. 7.3.1.8.1.6.1.3 Sampling Rate: 32 kHz or 29.4 kHz
                4. 7.3.1.8.1.6.1.4 Sampling Rate: 48 kHz or 44.1 kHz
                5. 7.3.1.8.1.6.1.5 Sampling Rate: 96 kHz or 88.2 kHz
                6. 7.3.1.8.1.6.1.6 Sampling Rate: 384 kHz or 352.8 kHz
        9. 7.3.1.9 Interrupts, Status, and Digital I/O Pin Multiplexing
    4. 7.4 Device Functional Modes
    5. 7.5 Register Maps
      1. 7.5.1 TAD5212_P0 Registers
      2. 7.5.2 TAD5212_P1 Registers
      3. 7.5.3 TAD5212_P3 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Application
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
  10. 9 Power Supply Recommendations
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.3 Recommended Operating Conditions

MIN NOM MAX UNIT
POWER
AVDD(1) Analog supply voltage to AVSS AVDD-3.3V Operation 3.0 3.3 3.6 V
AVDD(1) Analog supply voltage to AVSS - AVDD 1.8V operation 1.65 1.8 1.95 V
IOVDD IO supply voltage to VSS (thermal pad) - IOVDD 3.3-V operation 3.0 3.3 3.6 V
IO supply voltage to VSS (thermal pad) - IOVDD 1.8-V operation 1.65 1.8 1.95
IOVDD IO supply voltage to VSS (thermal pad) - IOVDD 1.2-V operation 1.08 1.2 1.32 V
INPUTS
INxx Analog input pins voltage to AVSS for line in bypass path Analog input pins voltage to AVSS for line in bypass path 0 5.6 V
INxx Analog input pins voltage to AVSS for microphone bypass path 0.1 MICBIAS – 0.1 V
Digital input pins voltage to VSS (thermal pad) 0 IOVDD V
ADDR ADDR pin w.r.t AVSS 0 AVDD V
TEMPERATURE
TA Operating ambient temperature –40 125 °C
OTHERS
GPIOx or GPIx (used as CCLK input) clock frequency 36.864(2) MHz
Cb SCL and SDA bus capacitance for I2C interface supports standard-mode
and fast-mode		 400 pF
SCL and SDA bus capacitance for I2C interface supports fast-mode plus 550
CL Digital output load capacitance 20 50 pF
(1) AVSS and VSS (thermal pad); all ground pins must be tied together and must not differ in voltage by more than 0.2 V.
(2) MCLK input rise time (VIL to VIH) and fall time (VIH to VIL) must be less than 5 ns. For better audio noise performance, MCLK input  must be used with low jitter.