JAJSIJ1G October   2009  – August 2023 TL331-Q1 , TL331B-Q1 , TL391B-Q1

PRODMIX  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings, TL331-Q1
    2. 6.2  Absolute Maximum Ratings, TL331B-Q1 and TL391B-Q1
    3. 6.3  ESD Ratings, All Devices
    4. 6.4  Recommended Operating Conditions, TL331-Q1
    5. 6.5  Recommended Operating Conditions, TL331B-Q1 and TL391B-Q1
    6. 6.6  Thermal Information
    7. 6.7  Electrical Characteristics, TL331B-Q1 and TL391B-Q1
    8. 6.8  Switching Characteristics, TL331B-Q1 and TL391B-Q1
    9. 6.9  Electrical Characteristics, TL331-Q1
    10. 6.10 Switching Characteristics, TL331-Q1
    11. 6.11 Typical Characteristics, TL331-Q1
    12. 6.12 Typical Characteristics, TL331B-Q1 and TL391B-Q1
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Voltage Comparison
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Voltage Range
        2. 8.2.2.2 TL331B-Q1 and TL391B-Q1 ESD Protection
        3. 8.2.2.3 Minimum Overdrive Voltage
        4. 8.2.2.4 Output and Drive Current
        5. 8.2.2.5 Response Time
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  11. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Thermal Information

THERMAL METRIC(1)TL331-Q1TL331B-Q1,
TL391B-Q1
UNIT
DBV (SOT-23)DBV (SOT-23)
5 PINS5 PINS
RθJAJunction-to-ambient thermal resistance218.3211.7°C/W
RθJC(top)Junction-to-case (top) thermal resistance87.3133.6°C/W
RθJBJunction-to-board thermal resistance44.979.9°C/W
ψJTJunction-to-top characterization parameter4.356.4°C/W
ψJBJunction-to-board characterization parameter44.179.6°C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.