JAJSDM5E September   2017  – November 2019 TLV7011 , TLV7012 , TLV7021 , TLV7022

PRODUCTION DATA.  

  1. 特長
  2. アプリケーション
  3. 概要
    1.     Device Images
      1.      X2SONパッケージと、SC70および米10セント硬貨との比較
      2.      伝搬遅延とオーバードライブとの関係
  4. 改訂履歴
  5. 概要 (続き)
  6. Pin Configuration and Functions
    1.     Pin Functions
    2.     Pin Functions: TLV7012/22
  7. Specifications
    1. 7.1  Absolute Maximum Ratings (Single)
    2. 7.2  Absolute Maximum Ratings (Dual)
    3. 7.3  ESD Ratings
    4. 7.4  Recommended Operating Conditions (Single)
    5. 7.5  Recommended Operating Conditions (Dual)
    6. 7.6  Thermal Information (Single)
    7. 7.7  Thermal Information (Dual)
    8. 7.8  Electrical Characteristics (Single)
    9. 7.9  Switching Characteristics (Single)
    10. 7.10 Electrical Characteristics (Dual)
    11. 7.11 Switching Characteristics (Dual)
    12. 7.12 Timing Diagrams
    13. 7.13 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Inputs
      2. 8.4.2 Internal Hysteresis
      3. 8.4.3 Output
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Inverting Comparator With Hysteresis for TLV701x
      2. 9.1.2 Noninverting Comparator With Hysteresis for TLV701x
    2. 9.2 Typical Applications
      1. 9.2.1 Window Comparator
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 IR Receiver Analog Front End
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curve
      3. 9.2.3 Square-Wave Oscillator
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 デバイス・サポート
      1. 12.1.1 開発サポート
        1. 12.1.1.1 評価基板
    2. 12.2 関連リンク
    3. 12.3 ドキュメントの更新通知を受け取る方法
    4. 12.4 コミュニティ・リソース
    5. 12.5 商標
    6. 12.6 静電気放電に関する注意事項
    7. 12.7 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Layout Guidelines

To reduce PCB fabrication cost and improve reliability, TI recommends using a 4-mil via at the center pad connected to the ground trace or plane on the bottom layer.

A power-supply bypass capacitor of 100 nF is recommended when supply output impedance is high, supply traces are long, or when excessive noise is expected on the supply lines. Bypass capacitors are also recommended when the comparator output drives a long trace or is required to drive a capacitive load. Due to the fast rising and falling edge rates and high-output sink and source capability of the TLV7011 and TLV7021 output stages, higher than normal quiescent current can be drawn from the power supply. Under this circumstance, the system would benefit from a bypass capacitor across the supply pins.