SBVS176B October 2011 – April 2016 TLV717P
PRODUCTION DATA.
Input and output capacitors should be placed as close to the device pins as possible. To improve AC performance (such as PSRR, output noise, and transient response), TI recommends designing the board with separate ground planes for VIN and VOUT, with the ground plane connected only at the device GND pin. In addition, the output capacitor ground connection should be connected directly to the device GND pin. High ESR capacitors may degrade PSRR performance.
The ability to remove heat from the die is different for each package type, presenting different considerations in the printed-circuit board (PCB) layout. The PCB area around the device that is free of other components moves the heat from the device to ambient air. Performance data for JEDEC-low and high-K boards are given in Thermal Information. Using heavier copper increases the effectiveness in removing heat from the device. The addition, plated through-holes to heat-dissipating layers also improves heatsink effectiveness.
Power dissipation depends on input voltage and load conditions. Power dissipation (PD) is equal to the product of the output current and the voltage drop across the output pass element, as shown in Equation 1.