JAJSFH2C November   2017  – March 2024 TLV755P

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Undervoltage Lockout (UVLO)
      2. 6.3.2 Enable (EN)
      3. 6.3.3 Internal Foldback Current Limit
      4. 6.3.4 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Input and Output Capacitor Selection
      2. 7.1.2 Dropout Voltage
      3. 7.1.3 Exiting Dropout
      4. 7.1.4 Reverse Current
      5. 7.1.5 Power Dissipation (PD)
        1. 7.1.5.1 Estimating Junction Temperature
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Input Current
        2. 7.2.2.2 Thermal Dissipation
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Examples
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 ドキュメントの更新通知を受け取る方法
    3. 8.3 サポート・リソース
    4. 8.4 Trademarks
    5. 8.5 静電気放電に関する注意事項
    6. 8.6 用語集
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • DYD|5
  • DBV|5
  • DQN|4
  • DRV|6
サーマルパッド・メカニカル・データ
発注情報

5.4 Thermal Information

PCB THERMAL METRIC(1) (2) TLV755 UNIT
DYD (SOT-23-5) DQN (X2SON) DBV (SOT-23-5) DRV (SON)
5 PINS 4 PINS 5 PINS 6 PINS
EVM RθJA Junction-to-ambient thermal resistance 60.3 N/A 100.8 N/A °C/W
ψJT Junction-to-top characterization parameter 14.2 N/A 23.3 N/A
ψJB Junction-to-board characterization parameter 35.9 N/A 67.8 N/A
JEDEC RθJA Junction-to-ambient thermal resistance 92.5 168.4 231.1 100.2 °C/W
RθJC(top)
Junction-to-case (top) thermal resistance

 119.8 139.1 118.4 108.5
RθJB
Junction-to-board thermal resistance

 45.8 101.4 64.4 64.3
ψJT Junction-to-top characterization parameter 16.7 5.6 28.4 10.4
ψJB Junction-to-board characterization parameter 44.9 101.7 63.8 64.8
RθJC(bot) Junction-to-case (bottom) thermal resistance 34.3 88.4 N/A 34.7
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.
(2) JEDEC thermal metrics apply to JEDEC standard PCB (2s2p, no vias to internal plane and bottom layer). EVM metrics  apply to the LP087A EVM with an exposed pad SOT-23-5 (DYD) layout.