JAJSJK9A December   2021  – June 2022 TMAG5328

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Magnetic Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Magnetic Flux Direction
      2. 7.3.2 Magnetic Response
      3. 7.3.3 Output Type
      4. 7.3.4 Sampling Rate
      5. 7.3.5 Adjustable Threshold
        1. 7.3.5.1 Adjustable Resistor
        2. 7.3.5.2 Adjustable Voltage
      6. 7.3.6 Hall Element Location
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Output Type Tradeoffs
      2. 8.1.2 Valid TMAG5328 Configurations
    2. 8.2 Typical Applications
      1. 8.2.1 Refrigerator Door Open/Close Detection
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  12. 11Device and Documentation Support
    1. 11.1 ドキュメントの更新通知を受け取る方法
    2. 11.2 サポート・リソース
    3. 11.3 Trademarks
    4. 11.4 静電気放電に関する注意事項
    5. 11.5 用語集
  13. 12メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1) TMAG5328 UNIT
SOT-23 (DBV)
6 PINS
RθJA Junction-to-ambient thermal resistance 167.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 84.1 °C/W
RθJB Junction-to-board thermal resistance 52.2 °C/W
ΨJT Junction-to-top characterization parameter 32 °C/W
ΨJB Junction-to-board characterization parameter 51.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance – °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.