SBOS685C April   2014  – July 2015 TMP007

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Spectral Responsivity
      2. 7.3.2 Field of View and Angular Response
      3. 7.3.3 Thermopile Principles and Operation
      4. 7.3.4 Object Temperature Calculation
      5. 7.3.5 Calibration
      6. 7.3.6 Sensor Voltage Format
      7. 7.3.7 Temperature Format
      8. 7.3.8 Serial Interface
        1. 7.3.8.1  Bus Overview
        2. 7.3.8.2  Serial Bus Address
        3. 7.3.8.3  Writing and Reading Operations
        4. 7.3.8.4  Slave Mode Operations
          1. 7.3.8.4.1 Slave Receiver Mode
          2. 7.3.8.4.2 Slave Transmitter Mode:
        5. 7.3.8.5  SMBus Alert Function
        6. 7.3.8.6  General Call
        7. 7.3.8.7  High-Speed (Hs) Mode
        8. 7.3.8.8  Timeout Function
        9. 7.3.8.9  Two-Wire Timing
        10. 7.3.8.10 Two-Wire Timing Diagrams
    4. 7.4 Device Functional Modes
      1. 7.4.1 Temperature Transient Correction
      2. 7.4.2 Alert Modes: Interupt (INT) and Comparator (COMP)
        1. 7.4.2.1 INT Mode (INT/COMP = 0)
        2. 7.4.2.2 COMP Mode (INT/COMP = 1)
      3. 7.4.3 Nonvolatile Memory Description
        1. 7.4.3.1 Programming the Nonvolatile Memory
        2. 7.4.3.2 Memory Store and Register Load From Memory
    5. 7.5 Register Maps
      1. 7.5.1  Sensor Voltage Result Register (address = 00h) [reset = 0000h]
      2. 7.5.2  TDIE Local Temperature Result Register (address = 01h) [reset = 0000h]
      3. 7.5.3  Configuration Register (address = 02h) [reset = 1440h]
      4. 7.5.4  TOBJ Object Temperature Result Register (address = 03h) [reset = 0000h]
      5. 7.5.5  Status Register (address = 04h) [reset = 0000h]
      6. 7.5.6  Status Mask and Enable Register (address = 05h) [reset = 0000h]
      7. 7.5.7  TOBJ Object Temperature High-Limit Register (address = 06h) [reset = 7FC0h]
      8. 7.5.8  TOBJ Object Temperature Low-Limit Register (address = 07h) [reset = 8000h]
      9. 7.5.9  TDIE Local Temperature High-Limit Register (address = 08h) [reset = 7FC0h]
      10. 7.5.10 TDIE Local Temperature Low-Limit Register (address = 09h) [reset = 8000h]
      11. 7.5.11 Coefficient Registers
        1. 7.5.11.1 S0 Coefficient Register (address = 0Ah) [reset = 260Eh]
        2. 7.5.11.2 A1 Coefficient Register (address = 0Bh) [reset = 0106h]
        3. 7.5.11.3 A2 Coefficient Register (address = 0Ch) [reset = FF9Bh]
        4. 7.5.11.4 B0 Coefficient Register (address = 0Dh) [reset = FF3Ah]
        5. 7.5.11.5 B1 Coefficient Register (address = 0Eh) [reset = FF71h]
        6. 7.5.11.6 B2 Coefficient Register (address = 0Fh) [reset = 0553h]
        7. 7.5.11.7 C2 Coefficient Register (address = 10h) [reset = 0000h]
        8. 7.5.11.8 TC0 Coefficient Register (address = 11h) [reset = 0034h]
        9. 7.5.11.9 TC1 Coefficient Register (address = 12h) [reset = 0000h]
      12. 7.5.12 Manufacturer ID Register (address = 1Eh) [reset = 5449h]
      13. 7.5.13 Device ID Register (address = 1Fh) [reset = 0078h]
      14. 7.5.14 Memory Access Register (address = 2Ah) [reset = 0000h]
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Wide-Range Calibration Example: TOBJ = 0°C to 60°C, Common Versus Unit Calibration
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Wide-Range Calibration
          2. 8.2.1.2.2 Verifying the Calibration
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Narrow-Range Calibration Example: TOBJ = 33°C to 41°C, Unit vs Common Calibration
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Narrow-Range Calibration
          2. 8.2.2.2.2 Verifying the Calibration
        3. 8.2.2.3 Application Curves
    3. 8.3 System Examples
      1. 8.3.1 Use of NEP, NETD, and Responsivity in Estimating System Performance
  9. Power-Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

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発注情報

7 Detailed Description

7.1 Overview

The TMP007 is an integrated digital thermopile temperature sensor in a wafer chip-scale package (WCSP) that detects the temperature of a remote object by its infrared (IR) emission. It is optimal for thermal management and thermal protection applications where remote noncontact temperature sensing is desired. The TMP007 is two-wire and SMBus interface compatible, and is specified over the temperature range of –40°C to 125°C. The TMP007 contains registers for holding configuration and calibration information, temperature limits, local temperature, TDIE, measurement results, and the thermopile voltage measurement result. The local temperature and the thermopile voltage measurements are used by the math engine to calculate the object temperature, which is then stored in the respective register. In addition, the TMP007 has an internal EPROM memory that can be used to store the factory default values and custom values for coefficients and calibration parameters. The values in EPROM can be transferred to the registers either individually or as a complete set.

The SDA (and SCL, if driven by an open-drain output) interface pin requires a pull-up resistor (10 kΩ, typical) as part of the communication bus. The ALERT pin is an open-drain output that must also use a pull-up resistor, or be left floating if unused. If desired, ALERT may be shared with other devices for a wired-OR implementation.

7.2 Functional Block Diagram

TMP007 fbd_sbos685.gif

7.3 Feature Description

The TMP007 senses the IR radiation that is emitted by all objects. The spectrum of the radiation depends only on the temperature and is given by Planck’s law, as shown in Equation 1:

Equation 1. TMP007 Eq01_B_sbos685.gif

where

  • h = Planck’s constant
  • c = speed of light
  • kB = Boltzmann’s constant
  • λ = wavelength in microns

The intensity of radiation from the object is determined by the emisivity (ε), a material-dependent property that scales the spectral response so that 0 < ε < 1. For an ideal black body, the radiation is at a maximum for a given temperature and ε = 1. The temperature is measured on the Kelvin scale where 0 K is absolute zero, or –273.15°C. Room temperature (25°C) is approximately 298.13 K. The emission spectra for objects at or near room temperature are shown in Figure 17. For these temperatures, the majority of the radiation emitted is in the wavelength range of 3 µm to 20 µm.

TMP007 C019_SBOS685.gif Figure 17. Black Body Emission Spectrum and Response

7.3.1 Spectral Responsivity

The TMP007 is optimized to sense IR radiation emitted by objects from approximately 250 K (–23°C) to 400 K (127°C), with maximum sensitivity from approximately 4 µm to 16 µm. The relative spectral response of the TMP007 is shown in Figure 18.

TMP007 C005_SBOS685.png Figure 18. Relative Spectral Response vs Wavelength

7.3.2 Field of View and Angular Response

The TMP007 senses all radiation within a defined field of view (FOV). The FOV (or full-angle of θ) is defined as 2Φ. The TMP007 contains no optical elements, and thus senses all radiation within the hemisphere to the front of the device. Figure 2 shows the angular dependence of the sensor response and the relative power for a circular object that subtends a half angle of phi (Φ). Figure 19 defines the angle Φ in terms of object diameter and distance. Figure 19 assumes that the object is well approximated as a plane that is perpendicular to the sensor axis.

TMP007 FOV_Geometry_SBOS685.gif Figure 19. FOV Geometry Definition

In this case, the maximum contribution is from the portion of the object directly in front of the TMP007 (Φ = 0), with the sensitivity per solid angle, dR/dΦ decreases as Φ increases. Approximately 50% of the energy sensed by the TMP007 is within a FOV (θ) = 90°.

This discussion is for illustrative purposes only; in practice the angular response (dR/dΦ) of the TMP007 to the object is affected by the object orientation, the number of objects, and the precise placement relative to the TMP007. Figure 20 shows the thermopile sensor dimensions.

TMP007 ai_thermopile_dimensions_sbos685.gif
NOTE: Thermopile sensor is centered in the device.
Figure 20. Thermopile Sensor Dimensions

7.3.3 Thermopile Principles and Operation

The TMP007 senses radiation by absorbing the radiation on a hot junction. The thermopile then generates a voltage proportional to the temperature difference between the hot junction, Thot, and the cold junction, Tcold.

TMP007 Principal_of_operation_SBOS685.gif Figure 21. Principle of Thermopile Operation

The cold junction is thermally grounded to the die, and is effectively TDIE, the die temperature. In thermal equilibrium, the hot junction is determined by the object temperature, TOBJ. The energy emitted by the object, EOBJ, minus the energy radiated by the die, EDIE, determines the temperature of the hot junction. The output voltage, VOUT, is therefore determined by the relationship shown in Equation 2:

Equation 2. TMP007 Eq02_NG_sbos685.gif

where

  • C is a constant depending on the design of the sensing element.

Note that the sensor voltage is related to both the object temperature and the die temperature. A fundamental characteristic of all thermopiles is that they measure temperature differentials, not absolute temperatures. The TMP007 contains a highly-accurate, internal temperature sensor to measure TDIE. Knowing TDIE and VSENSOR enables the TMP007 to estimate TOBJ. For each 250-ms conversion cycle, the TMP007 measures a value for VSENSOR and for TDIE, calculates TOBJ, and then places the values in the respective registers.

Bits CR2 to CR0 determine the number of local and sensor analog-to-digital converter (ADC) results to average before the object temperature is calculated.

After power-on reset (POR), the TMP007 starts in four conversions per second (mode 010). In general, for a mode with N conversions, the local temperature, TDIE, result is updated at the end of the Nth ADC conversion with the value shown in Equation 3:

Equation 3. TMP007 Eq03_tdie_sbos685.gif

Similarly, the sensor voltage result is updated at the end of the Nth sensor ADC conversion with the value shown in Equation 4:

Equation 4. TMP007 Eq04_vsen_sbos685.gif

These results are then used in the object temperature calculation by the math engine, which updates the object temperature result register. The total conversion time and averages per conversion can be optimized to select the best combination of update rate versus noise for an application. Additionally, low-power conversion mode is available. In CR settings 101, 110, and 111, the device inserts a standby time before the beginning of the next conversion or conversions.

The method and requirements for estimating TOBJ are described in the next section.

7.3.4 Object Temperature Calculation

The TMP007 generates a sensor voltage, VSensor, in register 00h that is related to the energy radiated by the object. For an ideal situation, the Stefan-Boltzman law relates the energy radiated by an object to its temperature by the relationship shown in Equation 5:

Equation 5. TMP007 Eq05_energy_sbos685.gif

where

  • σ = Stefan-Boltzman constant = 5.67 × 10-12 W/(cm2K4)
  • ε = Emissivity, 0 < ε < 1, an object dependent factor, ε = 1 for a perfect black body

A similar relationship holds for the sensing element itself that radiates heat at a rate determined by TDIE. The net energy absorbed by the sensor is then given by the energy absorbed from the object minus the energy radiated by the sensor, as shown in Equation 6:

Equation 6. TMP007 Eq06_vsen_sbos685.gif

In an ideal situation, the sensor voltage relates to object temperature as shown in Equation 7:

Equation 7. TMP007 Eq07_tobj_sbos685.gif
Equation 8. TMP007 Eq08_Tobj_sbos685.gif

where

  • S is a system-dependent parameter incorporating the object emissivity (ε), FOV, and sensor characteristics. The parameters S0, A1, and A2 are used in determining S.
  • f(VOBJ) is a function that compensates for heat flow other than radiation, such as convection and conduction, from nearby objects. The parameters B0, B1, and B2 are used to tune this function to a particular system and environment.

The coefficients affect object temperature measurement as described in Table 1.

Table 1. Calibration Coefficient Definitions

COEFFICIENT PURPOSE CALIBRATION COMMENT
S0 FOV and emissivity of object Application and object dependent Default values based on black body with ε = 0.95, and 110° FOV
A1, A2 Device properties Factory set Default values based on typical sensor characteristics
C2 Device properties Factory set Default values based on typical sensor characteristics
B0, B1, B2 Corrects for energy sources Environment dependent Calibrate in end-application environment

7.3.5 Calibration

The TMP007 default coefficients are calibrated with a black body of emissivity, ε = 0.95, and an FOV (θ) = 110°. Use these coefficients for applications where the object emissivity and geometry satisfy these conditions. For applications with different object emissivity or geometry, calibrate the TMP007 to accurately reflect the object temperature and system geometry. Accuracy is affected by device-to-device or object-to-object variation. For the most demanding applications, calibrate each device individually.

As an overview the calibration procedure includes:

  1. Defining the environmental variation range (die and object temperature range, supply voltage, temperature change speed, sampling rate and so on).
  2. Making the die temperature measurements and IR sensor voltage measurements over the environmental range.
  3. Generate an optimal set of coefficients based on the collected data set.
  4. Load the coefficients into the TMP007 coefficients register. The object temperature register reflects the best fit from the calibration process. Perform validation measurements because accuracy may vary over the environmental range. If the object temperature measurement error is not acceptable, repeat the calibration process using more environment points, data averaging, or narrow the temperature range of TDIE or TOBJ.
  5. After a suitable set of coefficients is obtained, they can be stored in nonvolatile memory. Each coefficient register can be programmed up to eight times. After POR, the last stored coefficient value is copied from the nonvolatile memory into the coefficient register.

The best temperature precision is available if every device is calibrated individually. Alternatively, if all the units in the application use the same coefficients, then calibrate a statistically significant number of devices, and load averaged coefficient values in nonvolatile memory.

Recalibration may be required under any or all of the following conditions:

  1. Board layout changed.
  2. Object or objects in the field of view changed.
  3. Object distance or object surface changed.
  4. Angle between device surface and direction to the object changed.
  5. Object and local temperature range changed outside the environmental calibration range.
  6. Object and local temperature transients significantly changed.
  7. Supply voltage changed more than 1 V.
  8. Air convection or conduction near the device changed.

For further information and methods for calibration, refer to SBOU142TMP007 Calibration Guide.

7.3.6 Sensor Voltage Format

The TMP007 provides 16 bits of data in binary twos complement format. The positive full-scale input produces an output code of 7FFFh and the negative full-scale input produces an output code of 8000h. The output clips at these codes for signals that exceed full-scale. Table 2 summarizes the ideal output codes for different input signals. Figure 22 illustrates code transitions versus input voltage. Full-scale is a 5.12-mV signal. The LSB size is 156.25 nV.

Table 2. Input Signal Versus Ideal Output Code(1)

SENSOR SIGNAL VOLTAGE OUTPUT CODE
FS (215 – 1) / 215 5.12 mV 7FFFh
FS / 215 156.25 nV 0001h
0 0 V 0000h
–FS / 215 –156.25 nV FFFFh
–FS –5.12 mV 8000h
(1) FS = Full-scale value.
TMP007 ai_transfer_code-vi_bos518.gif Figure 22. Code Transition Diagram

7.3.7 Temperature Format

The temperature register data format of the TMP007 is reported in a binary twos complement signed integer format, as Table 3 shows, with 1 LSB = (1 / 32)°C = 0.03125°C.

Table 3. Temperature Data Format

TEMPERATURE (°C) DIGITAL OUTPUT (BINARY) SHIFTED HEX
150 0100 1011 0000 0000 12C0
125 0011 1110 1000 0000 0FA0
100 0011 0010 0000 0000 0C80
80 0010 1000 0000 0000 0A00
75 0010 0101 1000 0000 0960
50 0001 1001 0000 0000 0640
25 0000 1100 1000 0000 0320
0.03125 0000 0000 0000 0100 0001
0 0000 0000 0000 0000 0000
–0.03125 1111 1111 1111 1100 FFFF
–0.0625 1111 1111 1111 1000 FFFE
–25 1111 0011 0111 0000 FCDC
–40 1110 1011 1111 1100 FAFF
–55 1110 0100 0111 1100 F91F

To convert the integer temperature result of the TMP007 to degrees Celsius, right-shift the result by two bits. Then perform a divide-by-32 of TDIE and TOBJ, the 14-bit signed integers contained in the corresponding registers. The sign of the temperature is the same as the sign of the integer read from the TMP007. In twos complement notation, the MSB is the sign bit. If the MSB is 1, the integer is negative and the absolute value can be obtained by inverting all bits and adding 1. An alternate method of calculating the absolute value of negative integers is abs(i) = i xor FFFFh + 1.

7.3.8 Serial Interface

The TMP007 operates only as a slave device on the serial bus. Connections to the bus are made using the SCL Input and open-drain I/O SDA line. The SDA and SCL pins feature integrated spike suppression filters and Schmitt triggers to minimize the effects of input spikes and bus noise. The TMP007 supports the transmission protocol for both fast and fastplus (1 kHz to 1 MHz) and high-speed (1 MHz to 2.5 MHz) mode. All data bytes are transmitted MSB first. At higher speeds, thermal dissipation affects device operation, including accuracy.

7.3.8.1 Bus Overview

The device that initiates a transfer is called a master, and the devices controlled by the master are slaves. The bus must be controlled by a master device that generates the serial clock (SCL), controls the bus access, and generates the start and stop conditions.

To address a specific device, a start condition is initiated, indicated by pulling the data-line (SDA) from a high-to-low logic level while SCL is high. All slaves on the bus shift in the slave address byte, with the last bit indicating whether a read or write operation is intended. During the ninth clock pulse, the slave being addressed responds to the master by generating an Acknowledge and pulling SDA low.

Data transfer is then initiated and sent over eight clock pulses followed by an acknowledge bit. During data transfer SDA must remain stable while SCL is high, as any change in SDA while SCL is high will be interpreted as a control signal.

Once all data has been transferred, the master generates a stop condition, indicated by pulling SDA from low to high while SCL is high.

7.3.8.2 Serial Bus Address

To communicate with the TMP007, the master must first address slave devices via a slave address byte. The slave address byte consists of seven address bits, and a direction bit indicating the intent of executing a read or write operation. The TMP007 features two address pins allowing up to eight devices to be connected on a single bus. Pin logic levels and the corresponding address values are described in Table 4.

Table 4. Address Pins and Slave Addresses

ADR1 ADR0 SMBus ADDRESSES
0 0 1000000
0 1 1000001
0 SDA 1000010
0 SCL 1000011
1 0 1000100
1 1 1000101
1 SDA 1000110
1 SCL 1000111

7.3.8.3 Writing and Reading Operations

Accessing a particular register on the TMP007 is accomplished by writing the appropriate value to the pointer register. The value for the pointer register is the first byte transferred after the slave address byte with the R/W bit low. Every write operation to the TMP007 requires a value for the pointer register (see Figure 24).

When reading from the TMP007, the last value stored in the pointer register by a write operation is used to determine which register is read by a read operation. To change the register pointer for a read operation, write a new value to the pointer register. This action is accomplished by issuing a slave address byte with the R/W bit low, followed by the pointer register byte. No additional data are required. The master then generates a start condition and sends the slave address byte with the R/W bit high to initiate the read command. See Figure 25 for details of this sequence. If repeated reads from the same register are desired, it is not necessary to continually send the pointer register byte because the TMP007 remembers the pointer register value until it is changed by the next write operation.

Note that register bytes are sent most significant byte first, followed by the least significant byte.

7.3.8.4 Slave Mode Operations

The TMP007 operates as a slave receiver or slave transmitter.

7.3.8.4.1 Slave Receiver Mode

The first byte transmitted by the master is the slave address, with the R/W bit low. The TMP007 then acknowledges reception of a valid address. The next byte transmitted by the master is the pointer register. The TMP007 then acknowledges reception of the pointer register byte. The next two bytes are written to the register addressed by the pointer register. The TMP007 acknowledges reception of both data bytes. The master terminates data transfer by generating a start or stop condition.

7.3.8.4.2 Slave Transmitter Mode:

The first byte is transmitted by the master and is the slave address, with the R/W bit high. The TMP007 acknowledges reception of a valid slave address. The next two bytes transmitted by the TMP007 are the value in the register indicated by the pointer register.

The master acknowledges reception of both data bytes. The master terminates the data transfer by generating a not-acknowledge bit on reception of any data byte, or generating a start or stop condition.

7.3.8.5 SMBus Alert Function

The TMP007 supports the SMBus alert function. When the TMP007 is operating in interrupt mode (TM = 1), the ALERT pin of the TMP007 can be connected as an SMBus alert signal. When a master senses that an alert condition is present on the ALERT line, the master sends an SMBus alert command (00011001) on the bus. If the ALERT pin of the TMP007 is active, the devices acknowledge the SMBus alert command and respond by returning its slave address on the SDA line. The eighth bit (LSB) of the slave address byte indicates if the cause of the alert condition is caused by the temperature exceeding THIGH or falling below TLOW. This bit is high if the temperature is greater than THIGH. This bit is low if the temperature is less than TLOW. See Figure 26 for details of this sequence.

If multiple devices on the bus respond to the SMBus alert command, arbitration during the slave address portion of the SMBus alert command determines which device clears the alert status. If the TMP007 wins the arbitration, its ALERT pin becomes inactive at the completion of the SMBus alert command. If the TMP007 loses the arbitration, the TMP007 ALERT pin remains active.

7.3.8.6 General Call

The TMP007 responds to a two-wire general call address (0000000) if the eighth bit is 0. The device acknowledges the general call address and respond to commands in the second byte. If the second byte is 00000110, the TMP007 internal registers are reset to power-up values.

7.3.8.7 High-Speed (Hs) Mode

In order for the two-wire bus to operate at frequencies above 400 kHz, the master device must issue an SMBus Hs-mode master code (00001xxx) as the first byte after a start condition to switch the bus to high-speed operation. The TMP007 does not acknowledge this byte, but switches its input filters on SDA and SCL, and its output filters on SDA to operate in Hs-mode, allowing transfers at up to 2.5 MHz. After the Hs-mode master code has been issued, the master transmits a two-wire slave address to initiate a data transfer operation. The bus continues to operate in Hs-mode until a stop condition occurs on the bus. Upon receiving the stop condition, the TMP007 switches the input and output filters back to fast-mode operation.

7.3.8.8 Timeout Function

The TMP007 resets the serial interface if SCL is held low for 30 ms (typ) between a start and stop condition. The TMP007 releases the bus if SCL is pulled low and waits for a start condition. To avoid activating the timeout function, maintain a communication speed of at least 1 kHz for SCL operating frequency.

7.3.8.9 Two-Wire Timing

The TMP007 is two-wire and SMBus compatible. Figure 23 to Figure 26 describe the various operations on the TMP007. Parameters for Figure 23 are defined in Table 5. Bus definitions are:

    Bus Idle Both SDA and SCL lines remain high.
    Start Data Transfer A change in the state of the SDA line, from high to low, while the SCL line is high defines a start condition. Each data transfer is initiated with a start condition.
    Stop Data Transfer A change in the state of the SDA line from low to high while the SCL line is high defines a stop condition. Each data transfer is terminated with a repeated start or stop condition.
    Data Transfer The number of data bytes transferred between a start and a stop condition is not limited, and is determined by the master device.

    The receiver acknowledges the transfer of data. It is also possible to use the TMP75B for single-byte updates. To update only the MS byte, terminate communication by issuing a start or stop condition on the bus.

    Acknowledge Each receiving device, when addressed, must generate an acknowledge bit.

    A device that acknowledges must pull down the SDA line during the acknowledge clock pulse so that the SDA line is stable low during the high period of the acknowledge clock pulse. Setup and hold times must be taken into account. When a master receives data, the termination of the data transfer can be signaled by the master generating a not-acknowledge (1) on the last byte transmitted by the slave.

Table 5. Two-Wire Timing Requirements

FAST MODE HIGH-SPEED MODE UNIT
MIN MAX MIN MAX
f(SCL) SCL operating frequency 0.001 0.4 0.001 2.5 MHz
t(BUF) Bus free time between stop and start condition 1300 260 ns
t(HDSTA) Hold time after repeated start condition.
After this period, the first clock is generated.
600 160 ns
t(SUSTA) Repeated start condition setup time 600 160 ns
t(SUSTO) Stop condition setup time 600 160 ns
t(HDDAT) Data hold time 0 900 0 150 ns
t(SUDAT) Data setup time 100 30 ns
t(LOW) SCL clock low period 1300 260 ns
t(HIGH) SCL clock high period 600 60 ns
tF, tR – SDA Data fall and rise time 300 80 ns
tF, tR – SCL Clock fall and rise time 300 40 ns
tR Rise time for SCL ≤ 100 kHz 1000 ns

7.3.8.10 Two-Wire Timing Diagrams

TMP007 ai_two_wire_tim_bos397.gif Figure 23. Two-Wire Timing Diagram
TMP007 ai_two_wire_write_bos685.gif
1. The value of A2, A1, and A0 are determined by the ADR1 and ADR0 pins.
Figure 24. Two-Wire Timing Diagram for Write Word Format
TMP007 ai_two_wire_read_bos685.gif
1. The value of A0, A1, and A2 are determined by the connections of the corresponding pins.
2. Master should leave SDA high to terminate a single-byte read operation.
3. Master should leave SDA high to terminate a two-byte read operation.
Figure 25. Two-Wire Timing Diagram for Read Word Format
TMP007 ai_tim_smbus_bos685.gif
1. The value of A0, A1, and A2 are determined by the connections of the corresponding pins.
Figure 26. Timing Diagram for SMBus Alert

7.4 Device Functional Modes

7.4.1 Temperature Transient Correction

Because the measured object temperature depends on TDIE, transient thermal events that change the die temperature affect the measurement. To compensate for this effect, the TMP007 math engine incorporates a transient correction option for use in applications where a thermal transient is anticipated. When transient correction is turned on, a filter with programmable coefficients is used to modify the sensor voltage result before the object temperature is calculated. This function helps reduce the jump in the object temperature result when there are large transients of the local die temperature, TDIE. The compensation incorporates the rate of change of TDIE and of VOBJ. The modified value for the sensor voltage used in VSENSOR to calculate the object temperature is shown in Equation 9:

Equation 9. TMP007 Eq09_vobj_sbos685.gif

where

  • TC0 and TC1 are weighting coefficients programmable using the registers.
  • TDIE_SLOPE is the change in die temperature with time.
  • VOBJ_SLOPE is the change in sensor voltage with time.

As a general guideline, turn on transient correction when the local temperature is changing at a rate greater than 1.5°C/min. When transient correction is on, the function corrects transients up to approximately 20°C/min.

Turning on the transient correction also turns on the output filter shown in Equation 10:

Equation 10. TMP007 Eq10_Tobj_sbos685.gif

If only the use of the output filter is desired without the input transient correction arithmetic, set the TC0 and TC1 coefficient values to 0 with TC bit in configuration register set to 1. When transition correction is on, the response to a step change has a time constant of approximately five times the sampling time.

When transient correction is on, the math engine modifies the sensor voltage result based on the transient correction equations. The nonmodified sensor voltage can be recovered with TC on by setting the TC1 and TC0 coefficients to 0. The output filtering cannot be turned off with TC bit set to 1.

7.4.2 Alert Modes: Interupt (INT) and Comparator (COMP)

The INT mode maintains the alert condition until a host controller clears the alert condition by reading the status register. This mode is useful when an external microcontroller is actively monitoring TMP007 as part of a thermal management system. The COMP mode asserts the ALERT pin and flags whenever the alert condition occurs, and deasserts the ALERT pin and flags without external intervention when the alert condition is no longer present This mode is often used to notify an external agent of an alert condition.

When servicing an alert from the TMP007, in some cases it may be useful to validate the alert condition by checking the status of the nDV, MEM_CRPT, and DATA_OVF flags.

7.4.2.1 INT Mode (INT/COMP = 0)

In this mode the high and low limits form a limit window. The ALRTEN bit must be asserted if the ALERT pin functionality is desired. If the calculated temperature is above the high limit or below the low limit at the end of a conversion its respective enabled flag is asserted.

TMP007 ai_comp_mode_sbos685.gif Figure 27. INT Mode

After the flag is asserted, it can only be cleared by a read of the status register, which clears the flag and the pin. The ALERT pin can also be cleared by the SMB alert response command (see the SMBus Alert Function section); however, this action does not clear the flag.

7.4.2.2 COMP Mode (INT/COMP = 1)

In COMP mode, the limits are used to form an upper limit threshold detector. If the calculated temperature is above the high limit, the high limit flag is asserted. The high limit flag is then deasserted only after the temperature goes below the low limit. The low limit register value determines the degree of hysteresis in the COMP function. In COMP mode, only the high limit enable has effect on the limit flags. The low limit enable flag does not have any effect on the low limit flags and the low limit flags always read 0. In this mode, the flags are asserted and deasserted only at the end of a conversion and cannot be cleared by a status register read or an SMB alert response.

TMP007 ai_int_mode_sbos685.gif Figure 28. COMP Mode

7.4.3 Nonvolatile Memory Description

7.4.3.1 Programming the Nonvolatile Memory

The TMP007 has an internal memory that can be programmed eight times. This internal memory stores power-on reset (POR) values for all writeable registers in the register map. The default POR values for each register are used if their memory location has not been overwritten through the I2C interface. The stored values in memory are loaded at power up, software reset, general load command, single load command, or SMBus general call reset.

On a memory store, bits NWr2:0 are incremented and indicate the number of writes remaining, as described in Table 6. Note the ambiguity in condition for code 000. Every memory location is individually writable, and the value returned for NWr depends on how many times that individual memory location has previously been written.

Table 6. Number of Writes Remaining to Nonvolatile Memory

NWr_2 NWR_1 NWR_0 TOTAL NUMBER WRITES PERFORMED TOTAL NUMBER OF WRITES REMAINING
0 0 0 0 8
0 0 0 1 7
0 0 1 2 6
0 1 0 3 5
0 1 1 4 4
1 0 0 5 3
1 0 1 6 2
1 1 0 7 1
1 1 1 8 0

To program the memory, write the desired value in the appropriate register address. Then write to the memory access register (2Ah) with 6Ah in the MSB (B15:B8), the 5-bit register address in B7:B3, and 1 in B1 (the single write bit in the same write operation). If 6Ah prefix code is not written, then the write operation is ignored. A sample flow is shown in Figure 29.

Figure 29. Sample Flow
Write Value to Target Register
Write to Memory Access Register Address 2Ah
2Ah Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Name NWr_2 NWr_1 NWr_0 Mem. Crpt Adr4 Adr3 Adr2 Adr1 Adr0 Gen Load MEM Store Sin Load.
Value 0 1 1 0 1 0 1 0 A4 A3 A2 A1 A0 0 1 0
Clear Target Register
Write to Memory Access Register (2Ah) to Load Value from Memory to Target Register
2Ah Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Name NWr_2 NWr_1 NWr_0 Mem. Crpt Adr4 Adr3 Adr2 Adr1 Adr0 Gen Load MEM Store Sin Load.
Value 0 1 1 0 1 0 1 0 A4 A3 A2 A1 A0 0 0 1
Read Target Register to Verify Programming

7.4.3.2 Memory Store and Register Load From Memory

The internal memory is accessed and the contents transferred to the registers on power up, single load, general load and reset operations. The transfer from internal memory to the registers takes 3 ms, during which the serial interface is disabled.

The serial interface does not acknowledge while the memory values are being loaded to the registers, and the device stops any data conversions in progress. The loaded values programmed in the register can be overwritten through the serial bus after the load. General load can be used to load all the registers from memory values at once. The NWr bits indicate the number of times a particular memory location has been written to. It is important to note that after a value has been overwritten in the memory, previous values are no longer accessible. Only the most recently written value is transferred from the memory to the register or registers.

7.5 Register Maps

The TMP007 registers contain the results of measurements, status information, temperature limit information for setting alert thresholds for both interrupt and compare modes, and the values of the coefficients and parameters currently being used.

Table 7. Internal Register Description

REGISTER ADDRESS RESET VALUE REGISTER NAME REGISTER DESCRIPTION
00h 0000h VSENSOR sensor voltage result Sensor voltage result register
01h 0000h TDIE local temperature result TDIE local temperature result register
02h 1440h Configuration Configuration register
03h 0000h TOBJ object temperature result TOBJ object temperature result register
04h 0000h Status Status register
05h 0000h Status mask and enable Mask and enable register
06h 7FC0h TOBJ object temperature high-limit TOBJ object temperature high-limit register
07h 8000h TOBJ object temperature low-limit TOBJ object temperature low-limit register
08h 7FC0h TDIE local temperature high-limit TDIE temperature high-limit register
09h 8000h TDIE local temperature low-limit TDIE temperature low-limit register
0Ah 260Eh S0 coefficient S0 coefficient register
0Bh 0106h A1 coefficient A1 coefficient register
0Ch FF9Bh A2 coefficient A2 coefficient register
0Dh FF3Ah B0 coefficient B0 coefficient register
0Eh FF71h B1 coefficient B1 coefficient register
0Fh 0553h B2 coefficient B2 coefficient register
10h 0000h C2 coefficient C2 coefficient register
11h 0034h TC0 coefficient TC0 coefficient register
12h 0000h TC1 coefficient TC1 coefficient register
1Eh 5449h Manufacturer ID Manufacturer ID register
1Fh 0078h Device ID Device ID register
2Ah 0E00h Memory access Memory access register

Table 8. Register Map

REGISTER
DESCRIPTION
ADDR R/W BIT DESCRIPTION
VSENSOR sensor voltage result 00h R V15 V14 V13 V12 V11 V10 V9 V8 V7 V6 V5 V4 V3 V2 V1 V0
TDIE local temperature result 01h R T13 T12 T11 T10 T9 T8 T7 T6 T5 T4 T3 T2 T1 T0
Configuration 02h R/W RST MOD CR2 CR1 CR0 ALRTEN ALRTF TC INT/
COMP
TOBJ object temperature result 03h R T13 T12 T11 T10 T9 T8 T7 T6 T5 T4 T3 T2 T1 T0 nDV
Status 04h R ALRTF CRTF OHF OLF AHF ALF nDVF Mem Crpt DATA_
OVF
Status mask and enable 05h R/W ALRTEN CRTEN OHEN OLEN LHEN LLEN DVEN MEM_
C_EN
TOBJ object temperature high-limit 06h R/W T9 T8 T7 T6 T5 T4 T3 T2 T1 T0
TOBJ object temperature low-limit 07h R/W T9 T8 T7 T6 T5 T4 T3 T2 T1 T0
TDIE local temperature high-limit 08h R/W T9 T8 T7 T6 T5 T4 T3 T2 T1 T0
TDIE local temperature low-limit 09h R/W T9 T8 T7 T6 T5 T4 T3 T2 T1 T0
S0 coefficient 0Ah R/W S0_15 S0_ S0_13 S0_12 S0_11 S0_10 S0_9 S0_8 S0_7 S0_6 S0_5 S0_4 S0_3 S0_2 S0_1 S0_0
A1 coefficient 0Bh R/W A1_15 A1_14 A1_13 A1_12 A1_11 A1_10 A1_9 A1_8 A1_7 A1_6 A1_5 A1_4 A1_3 A1_2 A1_1 A1_0
A2 coefficient 0Ch R/W A2_15 A2_14 A2_13 A2_12 A2_11 A2_10 A2_9 A2_8 A2_7 A2_6 A2_5 A2_4 A2_3 A2_2 A2_1 A2_0
B0 coefficient 0Dh R/W B0_15 B0_14 B0_13 B0_12 B0_11 B0_10 B0_9 B0_8 B0_7 B0_6 B0_5 B0_4 B0_3 B0_2 B0_1 B0_0
B1 coefficient 0Eh R/W B1_15 B1_14 B1_13 B1_12 B1_11 B1_10 B1_9 B1_8 B1_7 B1_6 B1_5 B1_4 B1_3 B1_2 B1_1 B1_0
B2 coefficient 0Fh R/W B2_15 B2_14 B2_13 B2_12 B2_11 B2_10 B2_9 B2_8 B2_7 B2_6 B2_5 B2_4 B2_3 B2_2 B2_1 B2_0
C2 coefficient 10h R/W C_11 C_10 C_9 C_8 C_7 C_6 C_5 C_4 C_3 C_2 C_1 C_0
TC0 coefficient 11h R/W TC0_15 TC0_14 TC0_13 TC0_12 TC0_11 TC0_10 TC0_9 TC0_8 TC0_7 TC0_6 TC0_5 TC0_4 TC0_3 TC0_2 TC0_1 TC0_0
TC1 coefficient 12h R/W TC1_15 TC1_14 TC1_13 TC1_12 TC1_11 TC1_10 TC1_9 TC1_8 TC1_7 TC1_6 TC1_5 TC1_4 TC1_3 TC1_2 TC1_1 TC1_0
Manufacturer ID 1Eh R ID15 ID14 ID13 ID12 ID11 ID10 ID9 ID8 ID7 ID6 ID5 ID4 ID3 ID2 ID1 ID0
Device ID 1Fh R DID11 DID10 DID9 DID8 DID7 DID6 DID5 DID4 DID3 DID2 DID1 DID0 RID3 RID2 RID1 RID0
Memory Access 2Ah R/W nwR_2 nwR_1 nwR_0 Mem Crpt Adr4 Adr3 Adr2 Adr1 Adr0 General Load Mem Store Single Load

7.5.1 Sensor Voltage Result Register (address = 00h) [reset = 0000h]

Figure 30. Sensor Voltage Result Register
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
V15 V14 V13 V12 V11 V10 V9 V8 V7 V6 V5 V4 V3 V2 V1 V0
R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
V15 to V0 : Sensor Voltage Result. Bits 15:0
Range: ±5.12 mV
Resolution: 156.25 nV/LSB
This is the digitized IR sensor voltage output in twos complement format.

7.5.2 TDIE Local Temperature Result Register (address = 01h) [reset = 0000h]

Figure 31. TDIE Local Temperature Result Register
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
T13 T12 T11 T10 T9 T8 T7 T6 T5 T4 T3 T2 T1 T0 0 0
R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
T13 to T0: Temperature result. Bits 15 to 2.
The data format is 14 bits, 0.03125°C per LSB in twos complement format. Full scale allows a result of up to ±256°C. Reset value is 00h.

7.5.3 Configuration Register (address = 02h) [reset = 1440h]

Figure 32. Configuration Register
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
RST MOD CR2 CR1 CR0 ALRTEN ALRTF TC INT/
COMP
R/W-0 R/W-0 R/W-0 R/W-1 R/W-0 R/W-1 R/W-0 R/W-0 R/W-0 R/W-1 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Note: Writing to the Configuration register will restart the ADC conversion (unless the write is to put the device in shutdown mode)
RST: Software Reset Bit. Bit 15 (Write Only)
Writing 1 to this bit generates a system reset that is the same as power on reset. It will reset all registers to default values including configuration register. This bit self-clears. Any conversion in progress is terminated.
MOD: Conversion Mode Select, Bit 12 (Read/Write)
Mode MOD
Power Down 0
Conversion ON 1 (default)
Selects the conversion mode of the device.
CR2 to CR0: Conversion Rate/Averaging Mode Bits. Bits 11 to 9
Controls the Number of conversions used to generate the value in the VSensor and TDIE registers.
There are a number of conversion modes available.
CR2 CR1 CR0 NUMBER OF AVERAGES PER CONVERSION TOTAL CONVERSION TIME (s) IQ µA AVERAGE
0 0 0 1 0.26 270
0 0 1 2 0.51 270
0 1 0 4 (default) 1.01 270
0 1 1 8 2.01 270
1 0 0 16 4.01 270
1 0 1 1 1.0 (Idle for 0.75) 85
1 1 0 2 4.0 ( Idle for 3.5) 60
1 1 1 4 4.0 (Idle for 3.0) 85
ALRTEN: Alert Pin Enable. Bit 8
Makes ALERT pin controlled by the alert flag bit. The ALERT pin is active low. The ALRTEN bit is mirrored in the status mask and enable register. Writing to the ALRTEN bit in the status mask and enable register also sets this bit, and vice versa.
ALRTF: Cumulative Alert Flag. Bit 7 (Read Only)
This flag is the logical OR of all enabled flags, and is cleared when the status register is read in INT mode or at the end of a conversion when all enabled flags are 0 in COMP mode.
It is mirrored in Status register.
TC: Transient Correction Enable. Bit 6
Setting this bit turns on the transient correction enabling sensor voltage and object temperature output filtering.
INT/COMP: INT/COMP Mode. Bit 5
The INT/COMP bit controls whether the limit flags are in INTERRUPT (INT) Mode (0) or COMPARATOR (COMP) Mode (1). It controls the behavior of the limit flags (LH, LL, OH, OL) and the data invalid flag (nDVF) from the status register.

7.5.4 TOBJ Object Temperature Result Register (address = 03h) [reset = 0000h]

Figure 33. TOBJ Object Temperature Result Register
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
T13 T12 T11 T10 T9 T8 T7 T6 T5 T4 T3 T2 T1 T0 nDV
R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
T13 to T0: Temperature result. Bits 15 to 2
The data format is twos complement, 14 bits, and 0.03125°C per LSB. Full scale allows a result of up to ±256°C. Reset value is 00h.
nDV: Data invalid bit. Bit 0
If this bit is set, it indicates that the calculated object temperature is not valid due to invalid operations in the math engine. The bit is reset in the next valid conversion.

7.5.5 Status Register (address = 04h) [reset = 0000h]

The status register flags are activated whenever their limit is violated, and latch if the INT/COMP bit is in INT mode (see configuration register). In INT mode these flags are cleared only when the status register is read. If the flag is set from a previous conversion, and at the end of the next conversion, the corresponding limit is not violating anymore, the flag is not cleared when in INT mode. In COMP mode, these flags are set whenever the corresponding limit is violated at the end of a conversion, and cleared if they are not.

Figure 34. Status Register
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
ALRTF CRTF OHF OLF LHF LLF nVDF MCRPT SNRL
R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
ALRTF: Cumulative Alert Flag Bit. Bit 15
This flag is the logical OR of all enabled flags, and is cleared when the status register is read in INT mode or at the end of a conversion when all enabled flags are 0 in COMP mode.
CRTF: Conversion Ready Flag. Bit 14
The conversion ready flag is provided to help coordinate one-shot conversions for temperature measurements. The bit is set after the local and object temperature conversions have completed and the results are ready to be read in the result registers. This flag can be cleared by reading the status register, writing to the configuration register or reading any of the results registers (TDIE, TOBJ, and so on). This flag is not affected by the INT/COMP bit setting and is always in latched mode.
OHF: Object Temperature High Limit Flag. Bit 13
This bit is set to 1 if the result in the object temperature register exceeds the value in the object temperature high limit register. In INT mode, this bit is cleared when the status register is read.
OLF: Object Temperature Low Limit Flag. Bit 12
This bit is set to 1 if the result in the object temperature register is less than the value in the object temperature low limit register. In INT mode, this bit is cleared when the status register is read. In COMP mode, this bit is disabled and always reads 0.
LHF: Local Temperature (TDIE) High Limit Flag. Bit 11
This bit is set to 1 if the result in the TDIE local temperature result register exceeds the value in the local temperature high limit register. In COMP mode, the bit is cleared to 0 when the result in the TDIE local temperature result register is less than the object temperature low limit. In INT mode, the bit is cleared when the status register is read.
LLF: Local Temperature (TDIE) Low Limit Flag. Bit 10
This bit is set to 1 if the result in the TDIE local temperature result register goes below the value in the local temperature low limit register. In INT mode, the bit is cleared when the status register is read. In COMP mode, the bit is disabled and always reads 0.
nDVF: Data Invalid Flag. Bit 9
If the calculated object temperature is invalid due to an internal error in the math engine or if sensor voltage is out of range, then Data invalid flag is set. In INT mode, this flag can only be cleared by reading the status register. In COMP mode it is cleared at the end of the conversion if the calculated object temperature and sensor voltage are valid.
MCRPT: Memory Corrupt Flag. Bit 8.
This flag indicates an internal check on the memory failed. This check is automatically performed only on a general load of the registers from memory that is done right after a power on reset, general call reset, or software reset (RST bit in the configuration register), or by forcing loads through the memory access register. When this bit is set, it can only be cleared by a clean pass of the internal check on memory.
Mirror of this bit is in memory access register, bit 12.
DOF: IR Data Overflow DATA_OVF Flag: Bit 7.
This flag indicates if sensor voltage measured is over range. Combined with the data invalid bit, it tells why data is invalid.
Bits 6 to 0: Not used. These bits always read 0.

7.5.6 Status Mask and Enable Register (address = 05h) [reset = 0000h]

Figure 35. Status Mask and Enable Register
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
ALRTEN CRTEN OHEN OLEN LHEN LLEN DVEN MEM_C_EN
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
ALRTEN: Alert Flag Enable Bit. Bit 15
0: ALRTF flag in status register cannot activate ALERT pin.
1: ALRTF flag any enabled flag in Status register will activate ALERT pin.
Can also be set by its mirror in Configuration register, bit 8.
CRTEN: Temperature Conversion Ready Enable Bit. Bit 14
0: CRTF flag in status register cannot activate ALRTF
1: CRTF flag in Status register will activate ALRTF.
OHEN: Object Temperature High Limit Enable Bit. Bit 13
0: OHF flag in Status register cannot activate ALRTF.
1: OHF flag in Status register will activate ALRTF.
OLEN: Object Temperature Low Limit Enable Bit. Bit 12
INT Mode:
0: OLF flag in Status register cannot activate ALRTF.
1: OLF flag in Status register will activate ALRTF.
COMP Mode: This bit is disabled in COMP mode and will always read 0.
LHEN: TDIE Temperature High Limit Enable Bit. Bit 11
0: AHF flag in Status register cannot activate ALRTF.
1: AHF flag in Status register will activate ALRTF in INT mode
LLEN: TDIE Temperature Low Limit Enable Bit. Bit 10
INT Mode (Alert Mode):
0: ALF flag in Status register cannot activate ALRTF.
1: ALF flag in Status register will activate ALRTF in INT mode
COMP Mode: This bit is disabled in COMP mode and always read 0.
DVEN: Data invalid Flag Enable Bit. Bit 9
0: Data invalid Flag in Status register cannot activate ALRTF.
1: Data invalid Flag in Status register will activate ALRTF.
MEM_C_EN: Memory Corrupt Enable Bit. Bit 8
0: Memory Corrupt flag in Status register cannot activate ALRTF.
1: Memory Corrupt flag in Status register will activate ALRTF.

7.5.7 TOBJ Object Temperature High-Limit Register (address = 06h) [reset = 7FC0h]

Figure 36. TOBJ Object Temperature High-Limit Register
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
T9 T8 T7 T6 T5 T4 T3 T2 T1 T0
R/W-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
T9 to T0: Object Temperature High Limit. Bits 15 to 6
The data format is 10 bits, 0.5°C per bit. Full scale allows a result of up to ±256C. Twos complement data.
Bits 5 to 0: Not used; these bits always read 0.

7.5.8 TOBJ Object Temperature Low-Limit Register (address = 07h) [reset = 8000h]

Figure 37. TOBJ Object Temperature Low-Limit Register
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
T9 T8 T7 T6 T5 T4 T3 T2 T1 T0
R/W-1 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
T9 to T0: Object Temperature Low Limit. Bits 15 to 6
The data format is 10 bits, 0.5°C per bit. Full scale allows a result of up to ±256C. Twos complement data.
Bits 5 to 0: Not used; these bits always read 0.

7.5.9 TDIE Local Temperature High-Limit Register (address = 08h) [reset = 7FC0h]

Figure 38. TDIE Local Temperature High-Limit Register
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
T9 T8 T7 T6 T5 T4 T3 T2 T1 T0
R/W-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
T9 to T0: TDIE Temperature High Limit. Bits 15 to 6
The data format is 10 bits with LSB of 0.5°C. Full scale allows a result of up to ±256C. Twos complement data.
Bits 5 to 0: Not used; these bits always read 0.

7.5.10 TDIE Local Temperature Low-Limit Register (address = 09h) [reset = 8000h]

Figure 39. TDIE Local Temperature Low-Limit Register
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
T9 T8 T7 T6 T5 T4 T3 T2 T1 T0
R/W-1 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
T9 to T0: TDIE Temperature Low Limit. Bits 15 to 6.
The data format is 10 bits with LSB of 0.5°C. Full scale allows a result of up to ±256C. Twos complement data.
Bits 5 to 0: Not used; these bits always read 0.

7.5.11 Coefficient Registers

The values of the coefficient registers described above are used in the math engine. The range and resolution of the coefficients are shown in Table 9. The default coefficients, TC0 and TC1, are optimized for the default conversion mode (four averages per measurement). Different acquisition modes may require different values for the TC0 and TC1 coefficients.

Table 9. Coefficient Range and Resolution(1)

REGISTER ADDRESS VARIABLE BITS RANGE RESOLUTION DEFAULT VALUES HEX DEFAULT VALUES
0A S0 16 0 – 298E-15 LSB = 4.5475E-18 4.430E-14 0260Eh
0B A1 16 ±125E-3 LSB = 3.8150E-06 9.995E-04 0106h
0C A2 16 ±1.9E-3 LSB = 5.9600E-08 –6.020E-06 FF9Bh
0D B0 16 ±5.12E-3 LSB = 1.5625E-07 –3.094E-05 FF3Ah
0E B1 16 ±20E-6 LSB = 6.1035E-10 –8.728E-08 FF71h
0F B2 16 ±312E-9 LSB = 9.5367E-12 1.300E-08 0553h
10 C2 12 ±97.65 LSB = 4.7680E-02 0 0000h
11 TC0 16 ±163E-3 LSB = 5.0000E-06 2.600E-04 0034h
12 TC1 16 ±1024 LSB = 3.1250E-02 0 0000h
(1) All signed values are twos complement data.

7.5.11.1 S0 Coefficient Register (address = 0Ah) [reset = 260Eh]

Figure 40. S0 Coefficient Register
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
S0_15 S0_14 S0_13 S0_12 S0_11 S0_10 S0_9 S0_8 S0_7 S0_6 S0_5 S0_4 S0_3 S0_2 S0_1 S0_0
R/W-0 R/W-0 R/W-1 R/W-0 R/W-0 R/W-1 R/W-1 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-1 R/W-1 R/W-1 R/W-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
S0_15 to S0_0: S0 Coefficient Value. Bits 15 to 0.
Range and resolution given in Table 9

7.5.11.2 A1 Coefficient Register (address = 0Bh) [reset = 0106h]

Figure 41. A1 Coefficient Register
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
A1_15 A1_14 A1_13 A1_12 A1_11 A1_10 A1_9 A1_8 A1_7 A1_6 A1_5 A1_4 A1_3 A1_2 A1_1 A1_0
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-1 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-1 R/W-1 R/W-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
A1_15 to A1_0: A1 Coefficient Value. Bits 15 to 0.
Twos complement format. Range and resolution given in Table 9

7.5.11.3 A2 Coefficient Register (address = 0Ch) [reset = FF9Bh]

Figure 42. A2 Coefficient Register
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
A2_15 A2_14 A2_13 A2_12 A2_11 A2_10 A2_9 A2_8 A2_7 A2_6 A2_5 A2_4 A2_3 A2_2 A2_1 A2_0
R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-0 R/W-0 R/W-1 R/W-1 R/W-0 R/W-1 R/W-1
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
A2_15 to A2_0: A2 Coefficient Value. Bits 15 to 0
Twos complement format. Range and resolution given in Table 9

7.5.11.4 B0 Coefficient Register (address = 0Dh) [reset = FF3Ah]

Figure 43. B0 Coefficient Register
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
B0_15 B0_14 B0_13 B0_12 B0_11 B0_10 B0_9 B0_8 B0_7 B0_6 B0_5 B0_4 B0_3 B0_2 B0_1 B0_0
R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-0 R/W-0 R/W-1 R/W-1 R/W-1 R/W-0 R/W-1 R/W-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
B0_15 to B0_0: B0 Coefficient Value. Bits 15 to 0
Twos complement format. Range and resolution given in Table 9

7.5.11.5 B1 Coefficient Register (address = 0Eh) [reset = FF71h]

Figure 44. B1 Coefficient Register
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
B1_15 B1_14 B1_13 B1_12 B1_11 B1_10 B1_9 B1_8 B1_7 B1_6 B1_5 B1_4 B1_3 B1_2 B1_1 B1_0
R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-0 R/W-1 R/W-1 R/W-1 R/W-0 R/W-0 R/W-0 R/W-1
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
B1_15 to B1_0: B1 Coefficient Value. Bits 15 to 0
Twos complement format. Range and resolution given in Table 9

7.5.11.6 B2 Coefficient Register (address = 0Fh) [reset = 0553h]

Figure 45. B2 Coefficient Register
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
B2_15 B2_14 B2_13 B2_12 B2_11 B2_10 B2_9 B2_8 B2_7 B2_6 B2_5 B2_4 B2_3 B2_2 B2_1 B2_0
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-1 R/W-0 R/W-1 R/W-0 R/W-1 R/W-0 R/W-1 R/W-0 R/W-0 R/W-1 R/W-1
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
B2_15 to B2_0: B2 Coefficient Value. Bits 15 to 0
Twos complement format. Range and resolution given in Table 9

7.5.11.7 C2 Coefficient Register (address = 10h) [reset = 0000h]

Figure 46. C2 Coefficient Register
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
C2_11 C2_10 C2_9 C2_8 C2_7 C2_6 C2_5 C2_4 C2_3 C2_2 C2_1 C2_0
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
C2_11 to C2_0: C2 Coefficient Value. Bits 15 to 4
Twos complement format. Range and resolution given in Table 9

7.5.11.8 TC0 Coefficient Register (address = 11h) [reset = 0034h]

Figure 47. TC0 Coefficient Register
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
TC0_
15
TC0_
14
TC0_
13
TC0_
12
TC0_
11
TC0_
10
TC0_9 TC0_8 TC0_7 TC0_6 TC0_5 TC0_4 TC0_3 TC0_2 TC0_1 TC0_0
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-1 R/W-1 R/W-0 R/W-1 R/W-0 R/W-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
TC0_15 to TC0_0: TC0 Coefficient Value. Bits 15 to 0
Twos complement format. Range and resolution given in Table 9

7.5.11.9 TC1 Coefficient Register (address = 12h) [reset = 0000h]

Figure 48. TC1 Coefficient Register
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
TC1_
15
TC1_
14
TC1_
13
TC1_
12
TC1_
11
TC1_
10
TC1_9 TC1_8 TC1_7 TC1_6 TC1_5 TC1_4 TC1_3 TC1_2 TC1_1 TC1_0
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
TC1_15 to TC1_0: TC1 Coefficient Value. Bits 15 to 0
Twos complement format. Range and resolution given in Table 9

7.5.12 Manufacturer ID Register (address = 1Eh) [reset = 5449h]

Figure 49. Manufacturer ID Register
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
ID15 ID14 ID13 ID12 ID11 ID10 ID9 ID8 ID7 ID6 ID5 ID4 ID3 ID2 ID1 ID0
R-0 R-1 R-0 R-1 R-0 R-1 R-0 R-0 R-0 R-1 R-0 R-0 R-1 R-0 R-0 R-1
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
ID15 to ID0: Manufacturer ID Bits. Bits 15 to 0. Reads 'TI' in ASCII code.

7.5.13 Device ID Register (address = 1Fh) [reset = 0078h]

Figure 50. Device ID Register
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
DID11 DID10 DID9 DID8 DID7 DID6 DID5 DID4 DID3 DID2 DID1 DID0 RID3 RID2 RID1 RID0
R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-1 R-1 R-1 R-1 R-0 R-0 R-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
DID11 to DID0: Device ID Bits. Bits 15 to 4. Reads 007h.
RID3 to RID0: Revision ID Bits. Bits 3 to 0. Reads 8h.

7.5.14 Memory Access Register (address = 2Ah) [reset = 0000h]

The internal memory can be accessed through the memory access register. When the register is read, it returns the values in read name. When the register is written to, it must contain the value 6Axxh to enable the contents of the register specified by Adr4 to Adr0 to be stored in memory.

Figure 51. Memory Access Register: Read
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
nwR_2 nwR_1 nwR_0 Mem Crpt Adr4 Adr3 Adr2 Adr1 Adr0 0 0 0
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Figure 52. Memory Access Register: Write
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
0 1 1 0 1 0 1 0 Adr4 Adr3 Adr2 Adr1 Adr0 General Load Mem Store Single Load
N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A
LEGEND: N/A = reset value not applicable for write operation.
nwR_2 to nwR_0: Number of Programs. Bits 15 to 13.
A memory location can be programmed a maximum of eight times. These bits contain the number of times this location has been programmed. After the eighth programming to a given location, subsequent attempts to program are ignored.
Mem Crpt: Memory Corrupt. Bit 12 (read only).
This bit is a mirror of bit 8 in the status register.
Adr4 to Adr0: Memory Address. Bits 7 to 3.
Used to specify register address to operate on. Address here is the same as the register in register address table..
General Load: General Load. Bit 2 (write only).
Loads all registers from memory with the last value stored in memory for that register. Adr[4:0] are don’t care in this case.
Mem Store: Memory Store. Bit 1 (write only).
Write 1 to this bit along with the register address to store that registers contents to memory.
Single Load: Single Load. Bit 0.
Performs an load of the memory contents to the register address determined by the Adr[4:0] bits.