11.1 Layout Guidelines
Mount the TMP303 to a PCB as shown in Figure 19. For this example the HYSTSET0 and HYSTSET1 pins are connected directly to ground. Connecting these pins to ground configures the device for 1°C hysteresis. The SOH pin is grounded in this layout. Leaving this pin floating has no effect on the behavior of the TMP303.
- Bypass the VS pin to ground with a low-ESR ceramic bypass capacitor. The typical recommended bypass capacitance is a 0.1-μF ceramic capacitor with a X5R or X7R dielectric. The optimum placement is closest to the VS and GND pins of the device. Take care in minimizing the loop area formed by the bypass-capacitor connection, the VS pin, and the GND pin of the IC. Additional bypass capacitance can be added to compensate for noisy or high-impedance power supplies.
- The OUT pin is a push-pull, active-high output and does not require a pullup resistor to VS.