SLVS921A March   2009  – July 2015 TPS22906

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Options
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Switching Characteristics - VIN = 1.1 V
    7. 7.7  Switching Characteristics - VIN = 1.2 V
    8. 7.8  Switching Characteristics - VIN = 1.8 V
    9. 7.9  Switching Characteristics - VIN = 2.5 V
    10. 7.10 Switching Characteristics - VIN = 3 V
    11. 7.11 Switching Characteristics - VIN = 3.6 V
    12. 7.12 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 ON/OFF Control
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Input Capacitor
      2. 10.1.2 Output Capacitor
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 VIN to VOUT Voltage Drop
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Community Resources
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VIN Input voltage –0.3 4 V
VOUT Output voltage VIN + 0.3 V
VON Input voltage –0.3 4 V
PD Power dissipation at TA = 25°C 0.48 W
IMAX Maximum continuous switch current 500 mA
TA Operating free-air temperature range –40 85 °C
Maximum lead temperature (10-s soldering time), Tlead 300 °C
Storage temperature, Tstg -45 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VIN Input voltage range 1 3.6 V
VOUT Output voltage range VIN V
VIH High-level input voltage, ON 0.85 3.6 V
VIL Low-level input voltage, ON 0.4 V
CIN Input capacitor 1 μF

7.4 Thermal Information

THERMAL METRIC(1) TPS2206 UNIT
YZV (DSBGA)
4 PINS
RθJA Junction-to-ambient thermal resistance 189.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 1.9 °C/W
RθJB Junction-to-board thermal resistance 36.8 °C/W
ψJT Junction-to-top characterization parameter 11.3 °C/W
ψJB Junction-to-board characterization parameter 36.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

VIN = 1.0 V to 3.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER TEST CONDITIONS TA MIN TYP MAX UNIT
IIN Quiescent current IOUT = 0, VIN = VON VIN = 1.1 V Full 37 120 nA
VIN = 1.8 V Full 82 235
VIN = 3.6 V Full 204 880
IIN(OFF) OFF-state supply current VON = GND, OUT = Open VIN = 1.1 V Full 22 210 nA
VIN = 1.8 V Full 44 260
VIN = 3.6 V Full 137 700
IIN(LEAKAGE) OFF-state switch current VON = GND, VOUT = 0 VIN = 1.1 V Full 22 140 nA
VIN = 1.8 V Full 45 230
VIN = 3.6 V Full 137 610
rON ON-state resistance IOUT = - 200 mA VIN = 3.6 V 25°C 90 108 mΩ
Full 125
VIN = 2.5 V 25°C 100 120
Full 140
VIN = 1.8 V 25°C 114 138
Full 160
VIN = 1.2 V 25°C 172 210
Full 235
VIN = 1.1 V 25°C 204 330
Full 330
rPD Output pulldown resistance VIN = 3.3 V, VON = 0, IOUT = 30 mA 25°C 88 120 Ω
ION ON input leakage current VON = 1.1 V to 3.6 V or GND Full 25 nA

7.6 Switching Characteristics – VIN = 1.1 V

TA = 25°C , RL_CHIP = 120 Ω (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tON Turnon time RL = 500 Ω CL = 0.1 μF 531 μs
CL = 1 μF 596
CL = 3.3 μF 659
tOFF Turnoff time RL = 500 Ω CL = 0.1 μF 11 μs
CL = 1 μF 67
CL = 3.3 μF 225
tr VOUT rise time RL = 500 Ω CL = 0.1 μF 365 μs
CL = 1 μF 367
CL = 3.3 μF 395
tf VOUT fall time RL = 500 Ω CL = 0.1 μF 21 μs
CL = 1 μF 189
CL = 3.3 μF 565

7.7 Switching Characteristics – VIN = 1.2 V

TA = 25°C , RL_CHIP = 120 Ω (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tON Turnon time RL = 500 Ω CL = 0.1 μF 471 μs
CL = 1 μF 527
CL = 3.3 μF 587
tOFF Turnoff time RL = 500 Ω CL = 0.1 μF 10 μs
CL = 1 μF 61
CL = 3.3 μF 199
tr VOUT rise time RL = 500 Ω CL = 0.1 μF 324 μs
CL = 1 μF 325
CL = 3.3 μF 350
tf VOUT fall time RL = 500 Ω CL = 0.1 μF 20 μs
CL = 1 μF 175
CL = 3.3 μF 523

7.8 Switching Characteristics – VIN = 1.8 V

TA = 25°C , RL_CHIP = 120 Ω (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tON Turnon time RL = 500 Ω CL = 0.1 μF 302 μs
CL = 1 μF 335
CL = 3.3 μF 367
tOFF Turnoff time RL = 500 Ω CL = 0.1 μF 8 μs
CL = 1 μF 49
CL = 3.3 μF 167
tr VOUT rise time RL = 500 Ω CL = 0.1 μF 220 μs
CL = 1 μF 220
CL = 3.3 μF 235
tf VOUT fall time RL = 500 Ω CL = 0.1 μF 15 μs
CL = 1 μF 159
CL = 3.3 μF 481

7.9 Switching Characteristics – VIN = 2.5 V

TA = 25°C , RL_CHIP = 120 Ω (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tON Turnon time RL = 500 Ω CL = 0.1 μF 223 μs
CL = 1 μF 246
CL = 3.3 μF 268
tOFF Turnoff time RL = 500 Ω CL = 0.1 μF 7 μs
CL = 1 μF 47
CL = 3.3 μF 158
tr VOUT rise time RL = 500 Ω CL = 0.1 μF 175 μs
CL = 1 μF 175
CL = 3.3 μF 187
tf VOUT fall time RL = 500 Ω CL = 0.1 μF 18 μs
CL = 1 μF 185
CL = 3.3 μF 471

7.10 Switching Characteristics – VIN = 3 V

TA = 25°C , RL_CHIP = 120 Ω (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tON Turnon time RL = 500 Ω CL = 0.1 μF 191 μs
CL = 1 μF 211
CL = 3.3 μF 231
tOFF Turnoff time RL = 500 Ω CL = 0.1 μF 7 μs
CL = 1 μF 46
CL = 3.3 μF 156
tr VOUT rise time RL = 500 Ω CL = 0.1 μF 159 μs
CL = 1 μF 160
CL = 3.3 μF 170
tf VOUT fall time RL = 500 Ω CL = 0.1 μF 17 μs
CL = 1 μF 160
CL = 3.3 μF 473

7.11 Switching Characteristics – VIN = 3.6 V

TA = 25°C , RL_CHIP = 120 Ω (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tON Turnon time RL = 500 Ω CL = 0.1 μF 166 μs
CL = 1 μF 183
CL = 3.3 μF 201
tOFF Turnoff time RL = 500 Ω CL = 0.1 μF 7 μs
CL = 1 μF 45
CL = 3.3 μF 155
tr VOUT rise time RL = 500 Ω CL = 0.1 μF 146 μs
CL = 1 μF 146
CL = 3.3 μF 156
tf VOUT fall time RL = 500 Ω CL = 0.1 μF 17 μs
CL = 1 μF 161
CL = 3.3 μF 475

7.12 Typical Characteristics

TPS22906 g_ron_vin_lvs921.gifFigure 1. rON vs VIN
TPS22906 voltage_drop_lvs921.gifFigure 3. Voltage Drop vs Load Current
TPS22906 g_quiescurrent_ta_lvs921.gifFigure 5. Quiescent Current vs Temperature
(VIN = 3.3 V, IOUT = 0)
TPS22906 g_iinoff_ta_lvs921.gifFigure 7. IIN(OFF) vs Temperature (VIN = 3.3 V)
TPS22906 g_iinleak_ta_lvs921.gifFigure 9. IIN (Leakage) vs Temperature (VIN = 3.3 V)
TPS22906 g_trisefall_ta_lvs921.gifFigure 11. trise/tfall vs Temperature
TPS22906 g_tonresponse01_lvs921.gifFigure 13. tON Response
TPS22906 g_tonresponse03_lvs921.gifFigure 15. tON Response
TPS22906 g_tonresponse05_lvs921.gifFigure 17. tON Response
TPS22906 g_tonresponse07_lvs921.gifFigure 19. tON Response
TPS22906 g_toffresponse01_lvs921.gifFigure 21. tOFF Response
TPS22906 g_toffresponse03_lvs921.gifFigure 23. tOFF Response
TPS22906 g_toffresponse05_lvs921.gifFigure 25. tOFF Response
TPS22906 g_toffresponse07_lvs921.gifFigure 27. tOFF Response
TPS22906 g_ron_ta_lvs921.gifFigure 2. rON vs Temperature (VIN = 3.3 V)
TPS22906 g_quiescurrent_vin_lvs921.gifFigure 4. Quiescent Current vs VIN (VON = VIN, IOUT = 0)
TPS22906 g_iinoff_vin_lvs921.gifFigure 6. IIN(OFF) vs VIN (VON = 0 V)
TPS22906 g_iinleak_vin_lvs921.gifFigure 8. IIN(Leakage) vs VIN (IOUT = 0)
TPS22906 g_onstatethres_lvs921.gifFigure 10. ON-Input Threshold
TPS22906 g_tontoff_ta_lvs921.gifFigure 12. tON/tOFF vs Temperature
TPS22906 g_tonresponse02_lvs921.gifFigure 14. tON Response
TPS22906 g_tonresponse04_lvs921.gifFigure 16. tON Response
TPS22906 g_tonresponse06_lvs921.gifFigure 18. tON Response
TPS22906 g_tonresponse08_lvs921.gifFigure 20. tON Response
TPS22906 g_toffresponse02_lvs921.gifFigure 22. tOFF Response
TPS22906 g_toffresponse04_lvs921.gifFigure 24. tOFF Response
TPS22906 g_toffresponse06_lvs921.gifFigure 26. tOFF Response
TPS22906 g_toffresponse08_lvs921.gifFigure 28. tOFF Response