JAJSM08A december   2022  – june 2023 TPS281C30

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Thermal Information
    6. 7.6 Electrical Characteristics
    7. 7.7 SNS Timing Characteristics
    8. 7.8 Switching Characteristics
    9. 7.9 Typical Characteristics
  9. 8 Parameter Measurement Information
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Device Functional Modes
      1. 9.3.1 Working Mode
    4. 9.4 Feature Description
      1. 9.4.1 Accurate Current Sense
        1. 9.4.1.1 High Accuracy Sense Mode
      2. 9.4.2 Programmable Current Limit
        1. 9.4.2.1 Short-Circuit and Overload Protection
        2. 9.4.2.2 Capacitive Charging
      3. 9.4.3 Inductive-Load Switching-Off Clamp
      4. 9.4.4 Inductive Load Demagnetization
      5. 9.4.5 Full Protections and Diagnostics
        1. 9.4.5.1 Open-Load Detection
        2. 9.4.5.2 Thermal Protection Behavior
        3. 9.4.5.3 Undervoltage Lockout (UVLO) Protection
        4. 9.4.5.4 Overvoltage (OVP) Protection
        5. 9.4.5.5 Reverse Polarity Protection
        6. 9.4.5.6 Protection for MCU I/Os
        7. 9.4.5.7 Diagnostic Enable Function
        8. 9.4.5.8 Loss of Ground
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 IEC 61000-4-5 Surge
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Selecting RILIM
        2. 10.2.2.2 Selecting RSNS
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
        1. 10.4.1.1 EMC Considerations
      2. 10.4.2 Layout Example
        1. 10.4.2.1 PWP Layout without a GND Network
        2. 10.4.2.2 PWP Layout with a GND Network
        3. 10.4.2.3 RGW Layout with a GND Network
      3. 10.4.3 Thermal Considerations
  12. 11Device and Documentation Support
    1. 11.1 ドキュメントの更新通知を受け取る方法
    2. 11.2 サポート・リソース
    3. 11.3 Trademarks
    4. 11.4 静電気放電に関する注意事項
    5. 11.5 用語集
  13. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

10.4.3 Thermal Considerations

This device possesses thermal shutdown (TABS) circuitry as a protection from overheating. For continuous normal operation, the junction temperature should not exceed the thermal-shutdown trip point. If the junction temperature exceeds the thermal-shutdown trip point, the output turns off. When the junction temperature falls below the thermal-shutdown trip point, the output turns on again.

Calculate the power dissipated by the device according to Equation 13.

Equation 12. PT = IOUT2 x RDSON + VS x INOM

where

  • PT = Total power dissipation of the device

After determining the power dissipated by the device, calculate the junction temperature from the ambient temperature and the device thermal impedance.

Equation 13. TJ = TA + RθJA x PT

For more information please see How to Drive Resistive, Inductive, Capacitive, and Lighting Loads.