SGLS246B June   2004  – October 2016

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Charge-Pump Output Resistance
      2. 8.3.2 Efficiency Considerations
    4. 8.4 Device Functional Modes
      1. 8.4.1 Active-Schottky Diode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Capacitor Selection
        2. 9.2.2.2 Input Capacitor (CI)
        3. 9.2.2.3 Flying Capacitor (C(fly))
        4. 9.2.2.4 Output Capacitor (CO)
        5. 9.2.2.5 Power Dissipation
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
      1. 9.3.1 RC-Post Filter
      2. 9.3.2 LC-Post Filter
      3. 9.3.3 Rail Splitter
      4. 9.3.4 Combined Doubler/Inverter
      5. 9.3.5 Cascading Devices
      6. 9.3.6 Paralleling Devices
      7. 9.3.7 Shutting Down the TPS6040x-Q1
      8. 9.3.8 GaAs Supply
      9. 9.3.9 Step-Down Charge Pump
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
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サーマルパッド・メカニカル・データ
発注情報

11 Layout

11.1 Layout Guidelines

Figure 37 shows a PCB layout proposal for a single-layer board. Take care to connect all capacitors as close as possible to the device to achieve optimized output voltage ripple performance.

11.2 Layout Example

TPS60400-Q1 TPS60401-Q1 TPS60402-Q1 TPS60403-Q1 recommended_PCB_layout_for_TPS6040x_sgls246.gif Figure 37. Recommended PCB Layout for TPS6040x-Q1 (Top Layer)