JAJS536I October   2002  – December 2016 TPS61040 , TPS61041

PRODUCTION DATA.  

  1. 特長
  2. アプリケーション
  3. 概要
  4. 改訂履歴
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Peak Current Control
      2. 7.3.2 Soft Start
      3. 7.3.3 Enable
      4. 7.3.4 Undervoltage Lockout
      5. 7.3.5 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Inductor Selection, Maximum Load Current
        2. 8.2.2.2 Setting the Output Voltage
        3. 8.2.2.3 Line and Load Regulation
        4. 8.2.2.4 Output Capacitor Selection
        5. 8.2.2.5 Input Capacitor Selection
        6. 8.2.2.6 Diode Selection
      3. 8.2.3 Application Curves
    3. 8.3 System Examples
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 デベロッパー・ネットワークの製品に関する免責事項
    2. 11.2 関連リンク
    3. 11.3 コミュニティ・リソース
    4. 11.4 商標
    5. 11.5 静電気放電に関する注意事項
    6. 11.6 用語集
  12. 12メカニカル、パッケージ、および注文情報

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ(パッケージ|ピン)
  • DBV|5
  • DRV|6
サーマルパッド・メカニカル・データ
発注情報

Specifications

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Supply voltages on pin VIN (2) –0.3 7 V
Voltages on pins EN, FB (2) –0.3 VIN + 0.3 V
Switch voltage on pin SW (2) 30 30 V
Operating junction temperature, TJ –40 150 °C
Storage temperature, Tstg –65 150 °C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to network ground terminal.

ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±750
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions. Pins listed as ±XXX V may actually have higher performance.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions. Pins listed as ±YYY V may actually have higher performance.

Recommended Operating Conditions

MIN NOM MAX UNIT
VIN Input voltage range 1.8 6 V
VOUT Output voltage range 28 V
L Inductor(1) 2.2 10 μH
f Switching frequency(1) 1 MHz
CIN Input capacitor (1) 4.7 μF
COUT Output capacitor (1) 1 μF
TA Operating ambient temperature –40 85 °C
TJ Operating junction temperature –40 125 °C
See application section for further information.

Thermal Information

THERMAL METRIC(1) TPS61040 TPS61041 UNIT
DBV DDC DRV DBV DRV
5 PINS 5 PINS 6 PINS 5 PINS 6 PINS
RθJA Junction-to-ambient thermal resistance 205.2 214.7 83.0 205.2 83.0 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 118.3 38.5 57.1 118.3 57.1 °C/W
RθJB Junction-to-board thermal resistance 34.8 35.4 52.9 34.8 52.9 °C/W
ψJT Junction-to-top characterization parameter 12.2 0.4 2.4 12.2 2.4 °C/W
ψJB Junction-to-board characterization parameter 33.9 34.8 53.4 33.9 53.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 26.9 26.9 °C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

Electrical Characteristics

VIN = 2.4 V, EN = VIN, TA = –40°C to 85°C, typical values are at TA = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY CURRENT
VIN Input voltage range 1.8 6 V
IQ Operating quiescent current IOUT = 0 mA, not switching, VFB = 1.3 V 28 50 μA
ISD Shutdown current EN = GND 0.1 1 μA
VUVLO Undervoltage lockout threshold 1.5 1.7 V
ENABLE
VIH EN high level input voltage 1.3 V
VIL EN low level input voltage 0.4 V
II EN input leakage current EN = GND or VIN 0.1 1 μA
POWER SWITCH AND CURRENT LIMIT
Vsw Maximum switch voltage 30 V
toff Minimum off time 250 400 550 ns
ton Maximum on time 4 6 7.5 μs
RDS(on) MOSFET on-resistance VIN = 2.4 V; ISW = 200 mA; TPS61040 600 1000
RDS(on) MOSFET on-resistance VIN = 2.4 V; ISW = 200 mA; TPS61041 750 1250
MOSFET leakage current VSW = 28 V 1 10 μA
ILIM MOSFET current limit TPS61040 350 400 450 mA
ILIM MOSFET current limit TPS61041 215 250 285 mA
OUTPUT
VOUT Adjustable output voltage range VIN 28 V
Vref Internal voltage reference 1.233 V
IFB Feedback input bias current VFB = 1.3 V 1 μA
VFB Feedback trip point voltage 1.8 V ≤ VIN ≤ 6 V 1.208 1.233 1.258 V
Line regulation (1) 1.8 V ≤ VIN ≤ 6 V; VOUT = 18 V; Iload = 10 mA; CFF = not connected 0.05 %/V
Load regulation(1) VIN = 2.4 V; VOUT = 18 V; 0 mA ≤ IOUT ≤ 30 mA 0.15 %/mA
The line and load regulation depend on the external component selection. See the application section for further information.

Typical Characteristics

Table 1. Table of Graphs

FIGURE
η Efficiency vs Load current Figure 1, Figure 2, Figure 3
vs Input voltage Figure 4
IQ Quiescent current vs Input voltage and temperature Figure 5
VFB Feedback voltage vs Temperature Figure 6
ISW Switch current limit vs Temperature Figure 7
ICL Switch current limit vs Supply voltage, TPS61041 Figure 8
vs Supply voltage, TPS61040 Figure 9
RDS(on) RDS(on) vs Temperature Figure 10
vs Supply voltage Figure 11
Line transient response Figure 13
Load transient response Figure 14
Start-up behavior Figure 15
TPS61040 TPS61041 tc_eff_lvs413.gif
Figure 1. Efficiency vs Output Current
TPS61040 TPS61041 tc_eff3_lvs413.gif
Figure 3. Efficiency vs Load Current
TPS61040 TPS61041 tc_eff2_lvs413.gif
Figure 2. Efficiency vs Load Current
TPS61040 TPS61041 tc_eff4_lvs413.gif
Figure 4. Efficiency vs Input Voltage
TPS61040 TPS61041 tc_qu_lvs413.gif
Figure 5. TPS61040 Quiescent Current vs Input Voltage
TPS61040 TPS61041 tc_scl_lvs413.gif
Figure 7. TPS6104x Switch Current Limit vs Free-Air Temperature
TPS61040 TPS61041 tc_curr2_lvs413.gif
Figure 9. TPS61040 Current Limit vs Supply Voltage
TPS61040 TPS61041 tc_stat2_lvs413.gif
Figure 11. TPS6104x Static Drain-Source On-State Resistance vs Supply Voltage
TPS61040 TPS61041 tc_feed_lvs413.gif
Figure 6. Feedback Voltage vs Free-Air Temperature
TPS61040 TPS61041 tc_curr_lvs413.gif
Figure 8. TPS61041 Current Limit vs Supply Voltage
TPS61040 TPS61041 tc_stat_lvs413.gif
Figure 10. TPS6104x Static Drain-Source On-State Resistance vs Free-Air Temperature