JAJS462E May   2008  – May 2019 TPS61087

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      概略回路図
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Soft-Start
      2. 7.3.2 Frequency Select Pin (FREQ)
      3. 7.3.3 Undervoltage Lockout (UVLO)
      4. 7.3.4 Thermal Shutdown
      5. 7.3.5 Overvoltage Prevention
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Inductor Selection
        2. 8.2.2.2 Rectifier Diode Selection
        3. 8.2.2.3 Setting the Output Voltage
        4. 8.2.2.4 Compensation (COMP)
        5. 8.2.2.5 Input Capacitor Selection
        6. 8.2.2.6 Output Capacitor Selection
      3. 8.2.3 Application Curves
    3. 8.3 System Examples
      1. 8.3.1 General Boost Application Circuits
      2. 8.3.2 TFT LCD Application
      3. 8.3.3 White LED Applications
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 デベロッパー・ネットワークの製品に関する免責事項
    2. 11.2 商標
    3. 11.3 静電気放電に関する注意事項
    4. 11.4 Glossary
  12. 12メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1) TPS61087 UNIT
DRC DSC
10 PINS 10 PINS
RθJA Junction-to-ambient thermal resistance 54.7 55.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 67.2 84.8 °C/W
RθJB Junction-to-board thermal resistance 29.6 29.7 °C/W
ψJT Junction-to-top characterization parameter 2.3 5.4 °C/W
ψJB Junction-to-board characterization parameter 29.8 29.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 15.6 10.9 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.