SLVSCT9B November   2014  – January 2015 TPS65266

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Adjusting the Output Voltage
      2. 7.3.2  Enable and Adjusting UVLO
      3. 7.3.3  Soft-Start Time
      4. 7.3.4  Power-Up Sequencing
      5. 7.3.5  Boostrap Voltage and BST-LX UVLO
      6. 7.3.6  Out of Phase Operation
      7. 7.3.7  Output Overvoltage Protection (OVP)
      8. 7.3.8  Slope Compensation
      9. 7.3.9  Overcurrent Protection
        1. 7.3.9.1 High-Side MOSFET Overcurrent Protection
        2. 7.3.9.2 Low-Side MOSFET Overcurrent Protection
      10. 7.3.10 Power Good
      11. 7.3.11 Adjustable Switching Frequency
      12. 7.3.12 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation With VIN < 2.6 V (Minimum VIN)
      2. 7.4.2 Operation With EN Control
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Output Inductor Selection
        2. 8.2.2.2 Output Capacitor Selection
        3. 8.2.2.3 Input Capacitor Selection
        4. 8.2.2.4 Loop Compensation
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Related Parts
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature (unless otherwise noted) (1)
MIN MAX UNIT
Voltage at VIN1, VIN2, VIN3, VINQ –0.3 7 V
LX1, LX2, LX3 (maximum withstand voltage transient <20 ns) –1.0 7
BST1, BST2, BST3 referenced to LX1, LX2, LX3 pins respectively –0.3 7
EN1, EN2, EN3, PGOOD –0.3 7
FB1, FB2, FB3, COMP1 , COMP2, COMP3, SS1, SS2, SS3, ROSC –0.3 3.6
AGND, PGND1, PGND2, PGND3 –0.3 0.3
TJ Operating junction temperature –40 150 °C
Tstg Storage temperature –55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Voltage at VIN1, VIN2, VIN3, VINQ 2.7 6.5 V
LX1, LX2, LX3 (maximum withstand voltage transient <20 ns) –0.8 6.5
BST1, BST2, BST3 referenced to LX1, LX2, LX3 pins respectively –0.1 6.5
EN1, EN2, EN3, PGOOD –0.1 6.5
FB1, FB2, FB3, COMP1 , COMP2, COMP3, SS1, SS2, SS3, ROSC –0.1 3
TJ Operating junction temperature –40 125 °C

6.4 Thermal Information

THERMAL METRIC(1) TPS65266 UNIT
RHB
32 PINS
RθJA Junction-to-ambient thermal resistance 34.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 27.5
RθJB Junction-to-board thermal resistance 8.3
ψJT Junction-to-top characterization parameter 0.4
ψJB Junction-to-board characterization parameter 8.3
RθJC(bot) Junction-to-case (bottom) thermal resistance 2.8
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

TA = 25°C, VIN = 5 V, FSW = 1 MHz (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
INPUT SUPPLY VOLTAGE
VIN Input voltage range 2.7 6.5 V
UVLO VIN undervoltage lockout VIN rising 2.35 2.45 2.6 V
VIN falling 2.15 2.25 2.35 V
Hysteresis 200 mV
IDDSDN Shutdown supply current EN1 = EN2 = EN3 = 0 V 9 µA
IDDQ_NSW Input quiescent current without buck1/2/3 switching EN1 = EN2 = EN3 = 5 V,
FB1 = FB2 = FB3 = 0.8 V
790 µA
IDDQ_NSW1 EN1 = 5 V, EN2 = EN3 = 0 V,
FB1 = 0.8 V
340 µA
IDDQ_NSW2 EN2 = 5 V, EN1 = EN3 = 0 V,
FB2 = 0.8 V
340 µA
IDDQ_NSW3 EN3 = 5 V, EN1 = EN2 = 0 V,
FB3 = 0.8 V
340 µA
BUCK1, BUCK2, BUCK3
VFB Feedback voltage VCOMP = 1.2 V 0.594 0.6 0.606 V
VENXH EN1/2/3 high-level input voltage 1.2 1.26 V
VENXL EN1/2/3 low-level input voltage 1.1 1.15 V
IENX1 EN1/2/3 pullup current ENx = 1 V 1.8 2.1 2.4 µA
IENX2 EN1/2/3 pullup current ENx = 1.3 V 5.3 µA
IENhys Hysteresis current 3.2 µA
ISSX Soft-start charging current 4.5 5.5 6.5 µA
tON_MIN Minimum on-time 80 100 ns
Gm_EA Error amplifier transconductance –2 µA < ICOMPX < 2 µA 290 µS
Gm_PS1/2/3 COMP1/2/3 voltage to inductor current Gm(1) ILX = 0.5 A 10 A/V
ILIMIT1 Buck1 peak inductor current limit 3.9 4.6 5.3 A
ILIMITSINK1 Buck1 low-side sink current limit 1.4
ILIMIT2/3 Buck2/3 peak inductor current limit 2.5 3.1 3.7 A
ILIMITSINK2/3 Buck2/3 low-side sink current limit 1.2 A
Rdson_HS1 Buck1 high-side switch resistance VINQ = 5 V 45
Rdson_LS1 Buck1 low-side switch resistance VINQ = 5 V 50
Rdson_HS2 Buck2 high-side switch resistance VINQ = 5 V 60
Rdson_LS2 Buck2 low-side switch resistance VINQ = 5 V 60
Rdson_HS3 Buck3 high-side switch resistance VINQ = 5 V 60
Rdson_LS3 Buck3 low-side switch resistance VINQ = 5 V 60
HICCUP TIMING
tHiccup_wait Overcurrent wait time(1) 512 cycles
tHiccup_re Hiccup time before restart(1) 16382 cycles
POWER GOOD
Vth_PG Feedback voltage threshold FBx undervoltage falling 92.5 %VREF
FBx undervoltage rising 95 %VREF
tDEGLITCH(PG)_F PGOOD falling edge deglitch time 128 cycles
tRDEGLITCH(PG)_R PGOOD rising edge deglitch time 16350 cycles
IPG PGOOD pin leakage 1 µA
VLOW_PG PGOOD pin low voltage ISINK = 1 mA 0.4 V
OSCILLATOR
FSW Switching frequency ROSC = 51.1 kΩ 920 1000 1080 kHz
FSW_range Switching frequency 250 2400 kHz
FSYNC Clock sync frequency range 250 2400 kHz
tSYNC_w Clock sync minimum pulse duration 80 ns
FSYNC_HI Clock sync high threshold 2 V
VSYNC_LO Clock sync low threshold 0.4 V
THERMAL PROTECTION
TTRIP_OTP(1) Thermal protection trip point Temperature rising 160 °C
THYST_OTP(1) Hysteresis 20 °C
(1) Lab validation result

6.6 Typical Characteristics

TA = 25°C, VIN = 5 V, VOUT1 = 1.0 V, VOUT2 = 1.5 V, VOUT3 = 1.8 V FSW = 1 MHz (unless otherwise noted)
D001_SLVSCT9.gif
Figure 1. Buck1 Efficiency
D003_SLVSCT9.gif
Figure 3. Buck3 Efficiency
D005_SLVSCT9.gif
Figure 5. Buck2, Load Regulation
D007_SLVSCT9.gif
Figure 7. Buck1, Line Regulation
D009_SLVSCT9.gif
Figure 9. Buck3, Line Regulation
D011_SLVSCT9.gif
ROSC = 51.1 kΩ
Figure 11. Oscillator Frequency vs Temperature
D013_SLVSCT9.gif
VIN = 5 V EN = 1 V
Figure 13. EN Pin Pullup Current vs Temperature, EN = 1 V
D015_SLVSCT9.gif
VIN = 5 V
Figure 15. EN Pin Threshold Rising vs Temperature
D017_SLVSCT9.gif
VIN = 5 V
Figure 17. SS Pin Charge Current vs Temperature
D019_SLVSCT9.gif
VIN = 5 V
Figure 19. Buck2 High-Side Current Limit vs Temperature
D002_SLVSCT9.gif
Figure 2. Buck2 Efficiency
D004_SLVSCT9.gif
Figure 4. Buck1, Load Regulation
D006_SLVSCT9.gif
Figure 6. Buck3, Load Regulation
D008_SLVSCT9.gif
Figure 8. Buck2, Line Regulation
D010_SLVSCT9.gif
Figure 10. Voltage Reference vs Temperature
D012_SLVSCT9.gif
VIN = 5 V
Figure 12. Shutdown Quiescent Current vs Temperature
D014_SLVSCT9.gif
VIN = 5 V EN = 1.3 V
Figure 14. EN Pin Pullup Current vs Temperature, EN = 1.3 V
D016_SLVSCT9.gif
VIN = 5 V
Figure 16. EN Pin Threshold Falling vs Temperature
D018_SLVSCT9.gif
VIN = 5 V
Figure 18. Buck1 High-Side Current Limit vs Temperature
D020_SLVSCT9.gif
VIN = 5 V
Figure 20. Buck3 High-Side Current Limit vs Temperature