SLVSCD1C December   2013  – November 2015 TPS92561

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Basics of Operation
      2. 7.3.2 Sample Scope Capture
      3. 7.3.3 Output Current Control (ADJ, SEN)
      4. 7.3.4 Overcurrent Protection
      5. 7.3.5 Overvoltage Protection (OVP)
      6. 7.3.6 VCC Bias Supply and Start-Up
      7. 7.3.7 VCC and VP Connection
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Setting the Output Current
      2. 8.1.2 Selecting an Inductance
      3. 8.1.3 Important Design Consideration: Diode in Parallel With Sense Resistance
      4. 8.1.4 Gate Driver Operation
      5. 8.1.5 Output Bulk Capacitor
      6. 8.1.6 Phase Dimming
      7. 8.1.7 Example Circuits
    2. 8.2 Typical Applications
      1. 8.2.1 Offline Boost Schematic for Design Example
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Set the LED Current
            1. 8.2.1.2.1.1 Calculate ADJ Pin Resistors
            2. 8.2.1.2.1.2 Calculate the Current Sense Resistor
            3. 8.2.1.2.1.3 Calculate the SEN Pin Series Resistance
          2. 8.2.1.2.2 Calculate OVP Pin Resistors
          3. 8.2.1.2.3 Calculate Inductor Value and Ripple Current
          4. 8.2.1.2.4 Calculate the Output Capacitor Value
      2. 8.2.2 11-W, 120-VAC Input, 225-V Output, Offline Boost Design Example
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Set the LED Current
            1. 8.2.2.2.1.1 Calculate ADJ Pin Resistors
            2. 8.2.2.2.1.2 Calculate the Current Sense Resistor
            3. 8.2.2.2.1.3 Calculate the SEN Pin Series Resistance
          2. 8.2.2.2.2 Calculate OVP Pin Resistors
          3. 8.2.2.2.3 Calculate Inductor Value and Ripple Current
          4. 8.2.2.2.4 Calculate the Output Capacitor Value
        3. 8.2.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5 Pin Configuration and Functions

DGN Package
8-Pin HVSSOP
Top View
TPS92561 po_SLVSCD1.gif

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
GATE 1 O Gate driver output pin. Connect to the gate terminal of the low-side N-channel power FET. For off-line applications, use a gate resistance of ≥ 75 Ω.
SRC 2 I Gate driver return. Connect to the source terminal of the low-side, N-channel power FET. By connecting SRC to the FET source, switching current spikes are not passed through the sense resistor.
VCC 3 O Gate driver power rail. Connect a 0.47-µF minimum decoupling capacitor from this pin to SRC pin.
SEN 4 I LED current sense pin. Current sense input. For off-line applications, connect to SEN and the current sensing resistor through an R-C filter with a time constant similar to the converter switching frequency.
GND 5 — Ground. Connect to the system ground plane.
ADJ 6 I LED current adjust pin. Converter reference. Can be connected to the converter rectified AC for high power factor, or to the LED output voltage for improved line regulation.
OVP 7 I Overvoltage. Connect to resistor divider from VOUT (LED+) to detect overvoltage.
VP 8 I Power supply of the integrated circuit (IC). Connect to an appropriate voltage source to provide power for the IC. (VP ≤ 42 V) See Example Circuits for example diagrams.
PowerPAD — — Solder to printed circuit board (PCB) with or without thermal vias to enhance thermal performance. Although it can be left floating, TI recommends to connect the PowerPAD™ to GND.