JAJSEE1B January   2018  – January  2020 TPS92611-Q1

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     代表的なアプリケーションの図
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Device Bias
        1. 7.3.1.1 Power-On Reset (POR)
        2. 7.3.1.2 Low-Quiescent-Current Fault Mode
      2. 7.3.2 Constant-Current Driver
      3. 7.3.3 Device Enable
      4. 7.3.4 PWM Dimming
      5. 7.3.5 Diagnostics
        1. 7.3.5.1 DIAGEN
        2. 7.3.5.2 Low-Dropout Mode
        3. 7.3.5.3 Open-Circuit Detection
        4. 7.3.5.4 Short-to-GND Detection
        5. 7.3.5.5 Overtemperature Protection
      6. 7.3.6 Fault-Bus Output With One-Fails–All-Fail
    4. 7.4 Device Functional Modes
      1. 7.4.1 Undervoltage Lockout, V(SUPPLY) < V(POR_rising)
      2. 7.4.2 Normal Operation V(SUPPLY) ≥ 4.5 V
      3. 7.4.3 Low-Voltage Dropout
      4. 7.4.4 Fault Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Single-Channel LED Driver With Diagnostics
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Single-Channel LED Driver With Heat Sharing
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 ドキュメントのサポート
      1. 11.1.1 関連資料
    2. 11.2 ドキュメントの更新通知を受け取る方法
    3. 11.3 コミュニティ・リソース
    4. 11.4 商標
    5. 11.5 静電気放電に関する注意事項
    6. 11.6 Glossary
  12. 12メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1) TPS92611-Q1 UNIT
DGN (MSOP)
8 PINS
RθJA Junction-to-ambient thermal resistance 60 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 58.7 °C/W
RθJB Junction-to-board thermal resistance 25.6 °C/W
ψJT Junction-to-top characterization parameter 1.7 °C/W
ψJB Junction-to-board characterization parameter 25.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 11.3 °C/W
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.