The TRF1208 is available in a 2‑mm × 2‑mm, WQFN-FCRLF package that has excellent thermal properties. Connect the thermal pad underneath the chip to a ground plane. Short the ground plane to the other ground pins of the chip at four corners, if possible, to allow heat propagation to the top layer of PCB. Use a thermal via that connects the thermal pad plane on the top layer of the PCB to the inner layer ground planes to allow heat propagation to the inner layers.

The total power dissipation needs to be limited to keep the device junction temperature below 150°C for instantaneous power and below 125°C for continuous power.