JAJSC71E May   2016  – May 2019 TUSB1002

PRODUCTION DATA.  

  1. 特長
  2. アプリケーション
  3. 概要
    1.     Device Images
      1.      概略回路図
  4. 改訂履歴
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics, Power Supply
    6. 6.6  Electrical Characteristics
    7. 6.7  Power-Up Requirements
    8. 6.8  Timing Requirements
    9. 6.9  Switching Characteristics
    10. 6.10 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 4-Level Control Inputs
      2. 7.3.2 Linear Equalization
      3. 7.3.3 Adjustable VOD Linear Range and DC Gain
      4. 7.3.4 Receiver Detect Control
      5. 7.3.5 USB3.1 Dual Channel Operation (MODE = “F”)
      6. 7.3.6 USB3.1 Single Channel Operation (MODE = “1”)
      7. 7.3.7 PCIe/SATA/SATA Express Redriver Operation (MODE = “R”; CFG1 = "0"; CFG2 = "0" )
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Disconnect Mode
    5. 7.5 U0 Mode
    6. 7.6 U1 Mode
    7. 7.7 U2/U3 Mode
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical USB3.1 Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Typical SATA, PCIe and SATA Express Application
      1. 8.3.1 Design Requirements
      2. 8.3.2 Detailed Design Procedure
      3. 8.3.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 コミュニティ・リソース
    2. 11.2 商標
    3. 11.3 静電気放電に関する注意事項
    4. 11.4 Glossary
  12. 12メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Layout Guidelines

  • RXP/N and TXP/N pairs should be routed with controlled 90-Ω differential impedance (±15%).
  • Keep away from other high speed signals.
  • Intra-pair routing should be kept to within 2 mils.
  • Length matching should be near the location of mismatch
  • Each pair should be separated at least by 3 times the signal trace width.
  • The use of bends in differential traces should be kept to a minimum. When bends are used, the number of left and right bends should be as equal as possible and the angle of the bend should be ≥ 135 degrees. This minimizes any length mismatch causes by the bends; ad therefore, minimize the impact bends have on EMI.
  • Route all differential pairs on the same of layer.
  • The number of VIAS should be kept to a minimum. It is recommended to keep the VIAS count to 2 or less.
  • Keep traces on layers adjacent to ground plane.
  • Do NOT route differential pairs over any plane split.
  • Adding Test points causes impedance discontinuity; and therefore, negatively impact signal performance. If test points are used, they should be placed in series and symmetrically. They must not be placed in a manner that causes a stub on the differential pair.