SLLSEL4A September   2014  – October 2014 TUSB1210-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Handling Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Analog I/O Electrical Characteristics
    6. 6.6  Digital I/O Electrical Characteristics
    7. 6.7  Digital IO Pins (Non-ULPI)
    8. 6.8  PHY Electrical Characteristics
    9. 6.9  Pullup/Pulldown Resistors
    10. 6.10 OTG Electrical Characteristics
    11. 6.11 Power Characteristics
    12. 6.12 Switching Characteristics
    13. 6.13 Timing Requirements
      1. 6.13.1 Timing Parameter Definitions
      2. 6.13.2 Interface Target Frequencies
    14. 6.14 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Processor Subsystem
        1. 7.3.1.1 Clock Specifications
          1. 7.3.1.1.1 USB PLL Reference Clock
          2. 7.3.1.1.2 ULPI Input Clock Configuration
          3. 7.3.1.1.3 ULPI Output Clock Configuration
          4. 7.3.1.1.4 Clock 32 kHz
          5. 7.3.1.1.5 Reset
        2. 7.3.1.2 USB Transceiver
          1. 7.3.1.2.1 PHY Electrical Characteristics
            1. 7.3.1.2.1.1 LS/FS Single-Ended Receivers
            2. 7.3.1.2.1.2 LS/FS Differential Receiver
            3. 7.3.1.2.1.3 LS/FS Transmitter
            4. 7.3.1.2.1.4 HS Differential Receiver
            5. 7.3.1.2.1.5 HS Differential Transmitter
            6. 7.3.1.2.1.6 UART Transceiver
          2. 7.3.1.2.2 OTG Characteristics
    4. 7.4 Device Functional Modes
      1. 7.4.1 TUSB1210-Q1 Modes vs ULPI Pin Status
    5. 7.5 Register Map
      1. 7.5.1  VENDOR_ID_LO
      2. 7.5.2  VENDOR_ID_HI
      3. 7.5.3  PRODUCT_ID_LO
      4. 7.5.4  PRODUCT_ID_HI
      5. 7.5.5  FUNC_CTRL
      6. 7.5.6  FUNC_CTRL_SET
      7. 7.5.7  FUNC_CTRL_CLR
      8. 7.5.8  IFC_CTRL
      9. 7.5.9  IFC_CTRL_SET
      10. 7.5.10 IFC_CTRL_CLR
      11. 7.5.11 OTG_CTRL
      12. 7.5.12 OTG_CTRL_SET
      13. 7.5.13 OTG_CTRL_CLR
      14. 7.5.14 USB_INT_EN_RISE
      15. 7.5.15 USB_INT_EN_RISE_SET
      16. 7.5.16 USB_INT_EN_RISE_CLR
      17. 7.5.17 USB_INT_EN_FALL
      18. 7.5.18 USB_INT_EN_FALL_SET
      19. 7.5.19 USB_INT_EN_FALL_CLR
      20. 7.5.20 USB_INT_STS
      21. 7.5.21 USB_INT_LATCH
      22. 7.5.22 DEBUG
      23. 7.5.23 SCRATCH_REG
      24. 7.5.24 SCRATCH_REG_SET
      25. 7.5.25 SCRATCH_REG_CLR
      26. 7.5.26 VENDOR_SPECIFIC1
      27. 7.5.27 VENDOR_SPECIFIC1_SET
      28. 7.5.28 VENDOR_SPECIFIC1_CLR
      29. 7.5.29 VENDOR_SPECIFIC2
      30. 7.5.30 VENDOR_SPECIFIC2_SET
      31. 7.5.31 VENDOR_SPECIFIC2_CLR
      32. 7.5.32 VENDOR_SPECIFIC1_STS
      33. 7.5.33 VENDOR_SPECIFIC1_LATCH
      34. 7.5.34 VENDOR_SPECIFIC3
      35. 7.5.35 VENDOR_SPECIFIC3_SET
      36. 7.5.36 VENDOR_SPECIFIC3_CLR
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Host or OTG, ULPI Input Clock Mode Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Unused Pins Connection
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Device, ULPI Output Clock Mode Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Unused Pins Connection
        3. 8.2.2.3 Application Curve
    3. 8.3 External Components
  9. Power Supply Recommendations
    1. 9.1 TUSB1210 Power Supply
    2. 9.2 Ground
    3. 9.3 Power Providers
    4. 9.4 Power Modules
      1. 9.4.1 VDD33 Regulator
      2. 9.4.2 VDD18 Supply
      3. 9.4.3 VDD15 Regulator
    5. 9.5 Power Consumption
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
      1. 11.5.1 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Via Channel
    2. 12.2 Packaging Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

1 Features

  • AEC-Q100 Qualified with:
    • Temperature Grade 3: –40°C to 85°C
    • HBM ESD Classification 1C
    • CDM ESD Classification C4B
  • USB2.0 PHY Transceiver Chip, Designed to Interface with a USB Controller via a ULPI 12-pin Interface, Fully Compliant With:
    • Universal Serial Bus Specification Rev. 2.0
    • On-The-Go Supplement to the USB 2.0 Specification Rev. 1.3
    • UTMI+ Low Pin Interface (ULPI) Specification Rev. 1.1
  • DP/DM Line External Component Compensation (Patent #US7965100 B1)
  • Interfaces to Host, Peripheral and OTG Device Cores; Optimized for Portable Devices or System ASICs with Built-in USB OTG Device Core
  • Complete USB OTG Physical Front-End that Supports Host Negotiation Protocol (HNP) and Session Request Protocol (SRP)
  • ULPI Interface:
    • I/O Interface (1.8 V) Optimized for Non-Terminated 50 Ω Line Impedance
    • ULPI CLOCK Pin (60 MHz) Supports Both Input and Output Clock Configurations
    • Fully Programmable ULPI-Compliant Register Set
  • Available in a 32-Pin Quad Flat No Lead
    [QFN (RHB)] Package

2 Applications

  • Mobile Phones
  • Tablet Devices
  • Desktop Computers
  • Portable Computers
  • Video Game Consoles
  • Portable Music Players

3 Description

The TUSB1210-Q1 is a USB2.0 transceiver chip, designed to interface with a USB controller via a ULPI interface. It supports all USB2.0 data rates (High-Speed 480 Mbps, Full-Speed 12 Mbps and Low-Speed 1.5 Mbps), and is compliant to both Host and Peripheral modes. It additionally supports a UART mode and legacy ULPI serial modes.

TUSB1210-Q1 also supports the OTG (Ver1.3) optional addendum to the USB 2.0 Specification, including Host Negotiation Protocol (HNP) and Session Request Protocol (SRP).

The DP/DM external component compensation in the transmitter compensates for variations in the series impendence in order to match with the data line impedance and the receiver input impedance, to limit data reflections, and thereby, improve eye diagrams.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
TUSB1210-Q1 VQFN (32) 5.00 mm x 5.00 mm
  1. For all available packages, see the orderable addendum at the end of the datasheet.

Diagram

fp_diagram_sllsel4.png

4 Revision History

Changes from * Revision (September 2014) to A Revision