SLVSC86A January   2014  – March 2014 UCD9244-EP

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (Continued)
  6. 6 Terminal Configuration and Functions
    1.     Terminal Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  Handling Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Electrical Characteristics (Continued)
    7. 7.7  ADC Monitoring Intervals And Response Times
    8. 7.8  Hardware Fault Detection Latency
    9. 7.9  PMBus/SMBus/I2C
    10. 7.10 I2C/SMBus/PMBus Timing Requirements
    11. 7.11 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  PMBus Interface
      2. 8.3.2  Resistor Programmed PMBus Address Decode
      3. 8.3.3  VID Interface
      4. 8.3.4  Jtag Interface
      5. 8.3.5  Bias Supply Generator (Shunt Regulator Controller)
      6. 8.3.6  Power-On Reset
      7. 8.3.7  External Reset
      8. 8.3.8  ON_OFF_CONFIG
      9. 8.3.9  Output Voltage Adjustment
      10. 8.3.10 Calibration
      11. 8.3.11 Analog Front End (AFE)
      12. 8.3.12 Voltage Sense Filtering
      13. 8.3.13 DPWM Engine
      14. 8.3.14 Rail/Power Stage Configuration
      15. 8.3.15 DPWM Phase Synchronization
      16. 8.3.16 Output Current Measurement
      17. 8.3.17 Current Sense Input Filtering
      18. 8.3.18 Over-Current Detection
      19. 8.3.19 Input Voltage Monitoring
      20. 8.3.20 Input UV Lockout
      21. 8.3.21 Temperature Monitoring
      22. 8.3.22 Auxiliary ADC Input Monitoring
      23. 8.3.23 Soft Start, Soft Stop Ramp Sequence
      24. 8.3.24 Non-Volatile Memory Error Correction Coding
      25. 8.3.25 Data Logging
    4. 8.4 Device Functional Modes
      1. 8.4.1 4-Bit VID Mode
      2. 8.4.2 6-Bit VID Mode
      3. 8.4.3 8-Bit VID Mode
      4. 8.4.4 Current Foldback Mode
  9. 9 Applications and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Automatic System Identification (Auto-ID)
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Digital Compensator
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.4 Thermal Information

THERMAL METRIC(1)UCD9244-EPUNIT
QFN
64 TERMINAL
θJA Junction-to-ambient thermal resistance(2) 24.6 °C/W
θJCtop Junction-to-case (top) thermal resistance(3) 10
θJB Junction-to-board thermal resistance(4) 4.2
ψJT Junction-to-top characterization parameter(5) 0.2
ψJB Junction-to-board characterization parameter(6) 4.1
θJCbot Junction-to-case (bottom) thermal resistance(7) 1
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953).
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8.
(5) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining RθJA, using a procedure described in JESD51-2a (sections 6 and 7).
(6) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining RθJA, using a procedure described in JESD51-2a (sections 6 and 7).
(7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
Spacer