JAJSC12D October   2013  – April 2018 TPS7B67-Q1

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      可変出力オプション
      2.      固定出力オプション
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Device Comparison
  7. 7 Pin Configuration and Functions
    1.     Pin Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Requirements
    7. 8.7 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagrams
    3. 9.3 Feature Description
      1. 9.3.1 Enable (EN)
      2. 9.3.2 Regulated Output (VOUT)
      3. 9.3.3 Power-On-Reset (RESET)
      4. 9.3.4 Reset Delay Timer (DELAY)
      5. 9.3.5 Adjustable Output Voltage (ADJ for TPS7B6701)
      6. 9.3.6 Undervoltage Shutdown
      7. 9.3.7 Thermal Shutdown
      8. 9.3.8 Thermal Protection
    4. 9.4 Device Functional Modes
      1. 9.4.1 Operation With VIN < 4 V
      2. 9.4.2 Operation With EN Control
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Power Dissipation and Thermal Considerations
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 Dropout Recovery
      1. 11.1.1 LDO Dropout Recovery Explained
      2. 11.1.2 TPS7B67xx-Q1 Dropout During Startup
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Enhanced Thermal Pad
      2. 12.1.2 Package Mounting
      3. 12.1.3 Board Layout Recommendations to Improve PSRR and Noise Performance
      4. 12.1.4 Additional Layout Considerations
    2. 12.2 Layout Example
  13. 13デバイスおよびドキュメントのサポート
    1. 13.1 関連リンク
    2. 13.2 ドキュメントの更新通知を受け取る方法
    3. 13.3 コミュニティ・リソース
    4. 13.4 商標
    5. 13.5 静電気放電に関する注意事項
    6. 13.6 Glossary
  14. 14メカニカル、パッケージ、および注文情報

8.4 Thermal Information

THERMAL METRIC(1)(2) TPS7B67xx-Q1 UNIT
PWP (HTSSOP)
20 PINS
RθJA Junction-to-ambient thermal resistance 44.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 27.4 °C/W
RθJB Junction-to-board thermal resistance 23.6 °C/W
ψJT Junction-to-top characterization parameter 1.1 °C/W
ψJB Junction-to-board characterization parameter 23.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 3.1 °C/W
(1) The thermal data is based on JEDEC standard high K profile — JESD 51-7. Two signal, two plane, four-layer board with 2-oz copper. The copper pad is soldered to the thermal land pattern. Also correct attachment procedure must be incorporated.
(2) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.