JAJSG89A January   2015  – September 2018 TPL5010

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      簡略化されたアプリケーション回路図
  4. 4 改訂履歴
  5. 5 デバイス比較表
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Ratings
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 WAKE
      2. 8.3.2 DONE
      3. 8.3.3 RSTn
    4. 8.4 Device Functional Modes
      1. 8.4.1 Start-Up
      2. 8.4.2 Normal Operating Mode
    5. 8.5 Programming
      1. 8.5.1 Configuring the WAKE Interval With the DELAY/M_RST Pin
      2. 8.5.2 Manual Reset
        1. 8.5.2.1 DELAY/M_RST
        2. 8.5.2.2 Circuitry
      3. 8.5.3 Timer Interval Selection Using External Resistance
      4. 8.5.4 Quantization Error
      5. 8.5.5 Error Due to Real External Resistance
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 ドキュメントの更新通知を受け取る方法
    2. 12.2 コミュニティ・リソース
    3. 12.3 商標
    4. 12.4 静電気放電に関する注意事項
    5. 12.5 Glossary
  13. 13メカニカル、パッケージ、および注文情報

7.4 Thermal Information

THERMAL METRIC(1) TPL5010 UNIT
DDC (SOT-23)
6 PINS
RθJA Junction-to-ambient thermal resistance 163 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 26 °C/W
RθJB Junction-to-board thermal resistance 57 °C/W
ψJT Junction-to-top characterization parameter 7.5 °C/W
ψJB Junction-to-board characterization parameter 57 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953).