JAJSTN3 December   2024 TMP113

ADVANCE INFORMATION  

1.   1
2. 1 特長
3. 2 アプリケーション
4. 3 概要
5. 4 Related Products
6. 5 Pin Configuration and Functions
7. 6 Specifications
   1. 6.1 Absolute Maximum Ratings
   2. 6.2 ESD Ratings
   3. 6.3 Recommended Operating Conditions
   4. 6.4 Thermal Information
   5. 6.5 Electrical Characteristics
   6. 6.6 I2C Interface Timing
   7. 6.7 Timing Diagrams
   8. 6.8 Typical Characteristics
8. 7 Detailed Description
   1. 7.1 Overview
   2. 7.2 Functional Block Diagram
   3. 7.3 Feature Description
      1. 7.3.1 Digital Temperature Output
      2. 7.3.2 Decoding Temperature Data
      3. 7.3.3 Temperature Limits and Alert
      4. 7.3.4 NIST Traceability
   4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous-Conversion Mode
      2. 7.4.2 One-Shot Mode
   5. 7.5 Programming
      1. 7.5.1 Serial Interface
      2. 7.5.2 Bus Overview
      3. 7.5.3 Device Address
      4. 7.5.4 Bus Transactions
         1. 7.5.4.1 Writes
         2. 7.5.4.2 Reads
         3. 7.5.4.3 General Call Reset Function
         4. 7.5.4.4 SMBus Alert Response
         5. 7.5.4.5 Time-Out Function
         6. 7.5.4.6 Coexist on I3C Mixed Bus
9. 8 Register Map
   1. 8.1 Temp_Result Register (address = 00h) [reset = 0000h]
   2. 8.2 Configuration Register (address = 01h) [reset = 40A0h]
   3. 8.3 TLow_Limit Register (address = 02h) [reset = 4B00h]
   4. 8.4 THigh_Limit Register (address = 03h) [reset = 5000h]
   5. 8.5 Device ID Register (Address = 0Bh) [reset = 113xh]
   6. 8.6 Unique_ID0 Register (Address = 0Ch) [reset = xxxxh]
   7. 8.7 Unique_ID1 Register (Address = 0Dh) [reset = xxxxh]
   8. 8.8 Unique_ID2 Register (Address = 0Eh) [reset = xxxxh]
10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Equal I2C Pullup and Supply Application
       1. 9.2.1 Design Requirements
       2. 9.2.2 Detailed Design Procedure
       3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
       1. 9.4.1 Layout Guidelines
       2. 9.4.2 Layout Example
11. 10Device and Documentation Support
    1. 10.1 Device Support
    2. 10.2 Documentation Support
       1. 10.2.1 Related Documentation
    3. 10.3 ドキュメントの更新通知を受け取る方法
    4. 10.4 サポート・リソース
    5. 10.5 静電気放電に関する注意事項
    6. 10.6 用語集
12. 11Revision History
13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
    2. 12.2 Tape and Reel Information