SBAU420 March   2023

 

  1.   TMAG5170D Evaluation Module Abstract
  2.   Trademarks
  3. 1Overview
    1. 1.1 Kit Contents
    2. 1.2 Related Documentation From Texas Instruments
  4. 2Hardware
    1. 2.1 Features
  5. 3Operation
    1. 3.1 Quick Start Setup
    2. 3.2 EVM Operation
      1. 3.2.1 Setup
        1. 3.2.1.1 Driver Installation
        2. 3.2.1.2 Firmware
          1. 3.2.1.2.1 Firmware Debug
        3. 3.2.1.3 GUI Setup and Usage
          1. 3.2.1.3.1 Initial Setup
          2. 3.2.1.3.2 GUI Operation
      2. 3.2.2 Rotate and Push Demonstration
        1. 3.2.2.1 Optimizing Device Angle Matching
      3. 3.2.3 Direct EVM Serial Communication
  6. 4Schematics, PCB Layout, and Bill of Materials
    1. 4.1 Schematics
    2. 4.2 PCB Layout
    3. 4.3 Bill of Materials

PCB Layout

#ID-E5855835-5838-4AEE-9DC5-2BB105FC1AD6 through #SBOU1659118 show the PCB layers of the EVM.

Figure 4-3 Top View
Figure 4-4 Top Layer
Figure 4-5 Bottom View
Figure 4-6 Bottom Layer