SBOK080 september   2023 SN54SC245-SEP

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Texas Instruments Enhanced Product Qualification and Reliability Report
  5. 2Space Enhanced Plastic Production Flow
    1. 2.1 Device Introduction
    2. 2.2 SN54SC245-SEP Production Flow Chart
  6. 3Device Qualification
    1. 3.1 Qualification by Similarity (Qualification Family)
  7. 4Outgas Test Report

Qualification by Similarity (Qualification Family)

A new device can be qualified either by performing a full scale quality and reliability test on the actual device or using one or more previously qualified devices through Qualification by Similarity (QBS) rules. By establishing similarities between the new device and those qualified previously, repetitive tests were eliminated, allowing for a timely production release. Qualifying the differences between a previously qualified product and the new product under consideration was emphasized when adopting the QBS methodology.

The QBS rules for a technology, product, test parameter, or package defines which attributes are required to remain fixed for the QBS rules to apply. The expected attributes that were allowed to vary was reviewed, and a QBS plan was developed based on the previous reliability impact assessment, specifying what subset of the full complement of environmental stresses were required to evaluate the reliability impact of those variations. Each new device was reviewed for the conformance to the QBS rule sets applicable to the device. For more information, see JEDEC JESD47.

Table 3-1 Space Enhanced Products New Device Qualification Matrix
Note that qualification by similarity (qualification family) per JEDEC JESD47 is allowed
Description Condition Sample Size Used/Rejects Lots Required Test Method
ElectromigrationMaximum recommended operating conditionsN/AN/APer TI design rules
Wire bond lifeMaximum recommended operating conditionsN/AN/APer TI design rules
Electrical characterizationTI data sheet301N/A
Electrostatic discharge sensitivityHBM3 units/voltage1EIA/JESD22-A114
CDMEIA/JESD22-C101
Latch-upPer technology3/01EIA/JESD78
Physical dimensionsTI data sheet5/01EIA/JESD22- B100
Thermal impedanceTheta-JA on boardPer Pin-PackageN/AEIA/JESD51
Bias life test125°C / 1000 hours or equivalent77/03JESD22-A108(1)
Biased HAST130°C / 85% / 96 hours77/03JESD22-A110(1)
Extended biased HAST130°C / 85% / 250 hours (for reference)77/01JESD22-A110(1)
Unbiased HAST130°C / 85% / 96 hours77/03JESD22-A110(1)
Temperature cycle−65°C to +150°C non-biased for 500 cycles77/03JESD22-A104(1)
Solder heat260°C for 10 seconds22/01JESD22-B106
Resistance to solventsInk symbol only12/01JESD22-B107
SolderabilityCondition A (steam age for 8 hours)22/01ANSI/J-STD-002-92
FlammabilityMethod A / Method B5/01UL-1964
Bond shearPer wire size5 units × 30/0 bonds3JESD22-B116
Bond pull strengthPer wire size5 units × 30/0 bonds3ASTM F-459
Die shearPer die size5/03TM 2019
High temperature storage150°C / 1,000 hours15/03JESD22-A103-A(1)
Moisture sensitivitySurface mount only121J-STD-020-A(1)
Radiation response characterizationTotal ionization dose, and single-event latchup5 units/dose level1MIL-STD-883/Method 1019
Outgassing characterizationTML (Total mass lost), CVCM (collected volatile condensable material), WVR (water vapor recorded)51ASTM E595
Precondition performed per JEDEC Std. 22, Method A112/A113