SCDA025 September   2022 TS3A27518E-Q1

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 TSSOP-24 Package
    2. 2.2 QFN-24 Package
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 TSSOP-24 Package
    2. 4.2 QFN-24 Package

Overview

This document contains information for TS3A27518E-Q1 (TSSOP-24 and QFN-24 package) to aid in a functional safety system design. Information provided are:

  • Functional Safety Failure In Time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
  • Component failure modes and their distribution (FMD) based on the primary function of the device

Figure 1-1 shows the device functional block diagram for reference.

GUID-9EA10218-DA10-48B8-AB96-2A0EB9D690E2-low.gif Figure 1-1 Functional Block Diagram

TS3A27518E-Q1 was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.