SCEU023 October   2021

 

  1.   Trademarks
  2. 1Introduction
    1. 1.1 Features
  3. 2Hardware
    1. 2.1 PCB Overview
    2. 2.2 Headers
    3. 2.3 Voltage Supply
    4. 2.4 Bypass Capacitors
    5. 2.5 OE Select
    6. 2.6 RC Loading
  4. 3Board Layout
  5. 4Schematic and Bill of Materials
    1. 4.1 Schematic
    2. 4.2 Bill of Materials

Headers

Each EVM board has header arrays for connection to the A and B side data pins, with ground oriented towards the device and the data headers closer to the board edges. Data pins inputs are marked Ax or Bx where x = 1, 2, 3 or 4. While outputs are marked AxY or BxY where x = 1, 2, 3 or 4 with the Y appended to indicate the pin as an output. Arrows are located in the middle section of the board which indicate the directionality of the pins from either A-side to B-side or vice versa.

All ground pins on their respective sections of the board are at the same ground potential and are boxed and labeled GND in the silkscreen of the EVM. All data I/O's in each TXU device have weak pulldowns integrated which allow for these headers to be left disconnected with a known state.