SCLK032 November   2023 SN74LV2T74-EP

PRODUCTION DATA  

  1.   1
  2.   Abstract
  3.   Trademarks
  4.   Qualification by Similarity (Qualification Family)

Qualification by Similarity (Qualification Family)

A new device can be qualified either by performing full scale quality and reliability tests on the actual device or using previously qualified device(s) through "Qualification by Similarity" (QBS) rules. By establishing similarity between the new device and those qualified previously, repetitive tests will be eliminated, allowing for timely production release. When adopting QBS methodology, the emphasis is on qualifying the differences between a previously qualified product and the new product under consideration. The QBS rules for a technology, product, test parameters or package shall define which attributes are required to remain fixed in order for the QBS rules to apply. The attributes which are expected and allowed to vary will be reviewed and a QBS plan shall be developed, based on the reliability impact assessment above, specifying what subset of the full complement of environmental stresses is required to evaluate the reliability impact of those variations. Each new device shall be reviewed for conformance to the QBS rule sets applicable to that device. See JEDEC JESD47 for more information.

Enhanced Products New Device Qualification Matrix (Note that qualification by similarity ("qualification family") per JEDEC JESD47 is allowed)
Description Condition Sample Size (Allowed Rejects) Lots Required Test Method
Electromigration Maximum Recommended Operating Conditions N/A N/A Per TI Design Rules
Wire Bond Life Maximum Recommended Operating Conditions N/A N/A Per TI Design Rules
Electrical Characterization TI Data Sheet 10 3 N/A
Electrostatic Discharge Sensitivity HBM 3 units/voltage N/A EIA/JESD22-A114
or
ANSI/ESDA/JEDEC JS-001
CDM EIA/JESD22-C101
or
ANSI/ESDA/JEDEC JS-002
Latch-up Per Technology 3(0) 1 EIA/JESD78
Physical Dimensions TI Data Sheet 5(0) 1 EIA/JESD22- B100
Thermal Impedance Theta-JA on board Per Pin-Package N/A EIA/JESD51
Bias Life Test 125°C/1000 hours or equivalent 45(0) 3 JESD22-A108(1)
Biased Humidity 85°C/85%/1000 hours 77(0) 3 JESD22-A101(1)
or
Biased HAST 130°C/85%/96 hours or 110°C/85%/264 hours JESD22-A110(1)
Extended Biased Humidity(2) 85°C/85%/2600 hours 77(-) 1 JESD22-A101(1)
or
Extended Biased HAST(2) 130°C / 85% / 250 hours or 110°C / 85% / 687 hours JESD22-A110(1)
Unbiased HAST 130°C / 85% / 96 hours or 110°C / 85% / 264 hours 77(0) 3 JESD22-A.118(1)
Temperature Cycle -65°C to +150°C non-biased for 500 cycles 77(0) 3 JESD22-A104(1)
Solder Heat 260°C for 10 seconds 22(0) 1 JESD22-B106
Resistance to Solvents Ink symbol only 12(0) 1 JESD22-B107
Solderability Bake Preconditioning 22(0) 1 ANSI/J-STD-002
Flammability Method A / Method B 5(0) 1 UL94
Bond Shear Per wire size 5 units x 30(0) bonds 3 JESD22-B116
Bond Pull Strength Per wire size 5 units x 30(0) bonds 3 ASTM F-459 or TM2011
Die Shear Per die size 5(0) 3 TM 2019
High Temperature Storage 150 °C / 1,000 hours 15(0) 3 JESD22-A103(1)
Moisture Sensitivity Surface Mount Only 12 1 J-STD-020(1)
Precondition performed per JEDEC Std. 22, Method A112/A113.
For information only.
Technology Family FIT / MTBF Data
Mean Time Between Fails (MTBF) and Failures in Time (FIT) rates are device reliability statistics calculated based on data collected from TI’s internal reliability testing (life test).

TI’s DPPM/FIT/MTBF Estimator Search Tool reports the generic data based on technology groupings and shows conditions under which the rates were derived. All terms used in the tool and definitions can be found on the TI reliability terminology page. Failure rates are summarized by technology and mapped to the associated material part numbers. The failure rates are highly dependent on the number of units tested, therefore, it is not recommended to compare failure rates.

TI DPPM/FIT/MTBF Estimator Search Tool webpage link:

www.ti.com/quality/docs/estimator.tsp

Device Family Qualification Data

TI’s Qualification Summary Search Tool reports generic qualification data representative of the material sets, processes, and manufacturing sites used by the device family and may not include all of the testing performed for a specific EP device. Please see the Enhanced Products New Device Qualification Matrix above for the full suite of qualification testing performed to release Enhanced Product devices.

TI Qualification Summary Search webpage link:

www.ti.com/qualificationsummary/qualsumm/home

Ongoing Reliability Monitoring

TI periodically monitors the reliability of its products, wafer fab processes, and package technologies, through its Ongoing Reliability Monitor (ORM) program. The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.

TI Ongoing Reliability Monitoring Search webpage link:

www.ti.com/orm/home?actionId=2801.html

For additional information or technical support please contact the Texas Instruments Customer Support Center at www.ti.com/csc For more information on TI Enhanced Products please visit www.ti.com/ep