SFFS079A June   2021  – October 2023 TPD3S713-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)
  7. 5Revision History

1 Overview

This document contains information for TPD3S713-Q1 (RVC package) to aid in a functional safety system design. Information provided are:

  • Functional Safety Failure In Time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
  • Component failure modes and their distribution (FMD) based on the primary function of the device
  • Pin failure mode analysis (Pin FMA)

Figure 1-1 shows the device functional block diagram for reference.

GUID-19823C18-706B-4919-A81C-A5D04A66B1F8-low.png Figure 1-1 Functional Block Diagram

TPD3S713-Q1 was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.