SFFS230 August   2021 TLV3603-Q1

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 DCK Package
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 DCK Package

DCK Package

Figure 4-1 shows the TLV3603-Q1 pin diagram for the DCK package. For a detailed description of the device pins please refer to the Pin Configuration and Functions section in the TLV3603-Q1 data sheet.

Figure 4-1 Pin Diagram (DCK) Package
Table 4-2 Pin FMA for Device Pins Short-Circuited to Ground
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class

OUT

1 Thermal stress due to high power dissipation

A

VEE

2 No change if same node as GND

D

IN+

3

Output goes low, if other input is positive

B

IN-

4

Output goes high, if other input is positive

B

LE /HYST

5

Output may be low or high

B

VCC

6

Main supply shorted out (no power to device)

B

Table 4-3 Pin FMA for Device Pins Open-Circuited
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class

OUT

1

Output can't drive application load

B

VEE

2

Lowest voltage pin will drive GND pin internally (via diode)

A

IN+

3

Output may be low or high

B

IN-

4

Output may be low or high

B

LE /HYST

5

Output may be low or high

C

VCC

6

Main supply open (no power to device)

B

Table 4-4 Pin FMA for Device Pins Short-Circuited to Adjacent Pin
Pin Name Pin No. Shorted to Description of Potential Failure Effect(s) Failure Effect Class

OUT

1

VEE

Thermal stress due to high power dissipation

A

VEE

2

IN+

Output goes low, if other input is positive

B

IN+

3

IN-

Output may be low or high

B

IN-

4

LE /HYST

Output may be low or high

C

LE /HYST

5

VCC

Output may be low or high

C

VCC

6

OUT

Thermal stress due to high power dissipation

A

Table 4-5 Pin FMA for Device Pins Short-Circuited to Supply
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class

OUT

1

Thermal stress due to high power dissipation

A

VEE

2

Main supply shorted out (no power to device)

B

IN+

3

Output goes high, if other input is less positive

B

IN-

4

Output goes low, if other input is less positive

B

LE /HYST

5

Output may be low or high

C

VCC

6

No change if same node as VCC

D