SFFS318A October   2021  – April 2022 TLC2272A-Q1

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 SOIC (D) 8 Package
    2. 2.2 TSSOP (PW) 8 Package
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 SOIC (D) 8 Package
    2. 4.2 TSSOP (PW) 8 Package
  6. 5Revision History

TSSOP (PW) 8 Package

This section provides Functional Safety Failure In Time (FIT) rates for the TSSOP (PW) 8 package of TLC2272A-Q1 based on two different industry-wide used reliability standards:

  • Table 2-3 provides FIT rates based on IEC TR 62380 / ISO 26262 part 11
  • Table 2-4 provides FIT rates based on the Siemens Norm SN 29500-2
Table 2-3 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11
FIT IEC TR 62380 / ISO 26262FIT (Failures Per 109 Hours)
Total Component FIT Rate

125

Die FIT Rate

116

Package FIT Rate

9

The failure rate and mission profile information in Table 2-3 comes from the Reliability data handbook IEC TR 62380 / ISO 26262 part 11:

  • Mission Profile: Motor Control from Table 11
  • Power dissipation: 848 mW
  • Climate type: World-wide Table 8
  • Package factor (lambda 3): Table 17b
  • Substrate Material: FR4
  • EOS FIT rate assumed: 0 FIT
Table 2-4 Component Failure Rates per Siemens Norm SN 29500-2
TableCategoryReference FIT RateReference Virtual TJ
5CMOS, BICMOS
Digital, analog / mixed
4 FIT45°C

The Reference FIT Rate and Reference Virtual TJ (junction temperature) in Table 2-4 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.