SLAU802 March   2019

 

  1.   MSP430FR2476 LaunchPad™ Development Kit (LP‑MSP430FR2476)
    1.     Trademarks
    2. 1 Getting Started
      1. 1.1 Introduction
      2. 1.2 Key Features
      3. 1.3 What’s Included
        1. 1.3.1 Kit Contents
        2. 1.3.2 Software Examples
      4. 1.4 First Steps: Out-of-Box Experience
        1. 1.4.1 Connecting to the Computer
        2. 1.4.2 Running the Out-of-Box Experience (OOBE)
      5. 1.5 Next Steps: Looking Into the Provided Code
    3. 2 Hardware
      1. 2.1 Block Diagram
      2. 2.2 Hardware Features
        1. 2.2.1 MSP430FR2476 MCU
        2. 2.2.2 eZ-FET Onboard Debug Probe With EnergyTrace™ Technology
        3. 2.2.3 Debug Probe Connection: Isolation Jumper Block
        4. 2.2.4 Application (or Backchannel) UART
        5. 2.2.5 Special Features
          1. 2.2.5.1 TMP235 Temperature Sensor
          2. 2.2.5.2 CR2032 Coin Cell Battery
      3. 2.3 Power
        1. 2.3.1 eZ-FET USB Power
        2. 2.3.2 CR2032 Battery Power
        3. 2.3.3 BoosterPack Plug-in Module and External Power Supply
      4. 2.4 Measure Current Draw of the MSP430 MCU
      5. 2.5 Clocking
      6. 2.6 Using the eZ-FET Debug Probe With a Different Target
      7. 2.7 BoosterPack Plug-in Module Pinout
      8. 2.8 Design Files
        1. 2.8.1 Hardware
        2. 2.8.2 Software
      9. 2.9 Hardware Change Log
    4. 3 Software Examples
      1. 3.1 Out-of-Box Software Example
        1. 3.1.1 Source File Structure
        2. 3.1.2 Overview
      2. 3.2 Blink LED Example
        1. 3.2.1 Source File Structure
    5. 4 Resources
      1. 4.1 Integrated Development Environments
        1. 4.1.1 TI Cloud Development Tools
          1. 4.1.1.1 TI Resource Explorer Cloud
          2. 4.1.1.2 Code Composer Studio Cloud
        2. 4.1.2 Code Composer Studio IDE
        3. 4.1.3 IAR Embedded Workbench for MSP430 IDE
      2. 4.2 LaunchPad Development Kit Websites
      3. 4.3 MSP430Ware and TI Resource Explorer
      4. 4.4 FRAM Utilities
        1. 4.4.1 Compute Through Power Loss
        2. 4.4.2 Nonvolatile Storage (NVS)
      5. 4.5 MSP430FR2476 MCU
        1. 4.5.1 Device Documentation
        2. 4.5.2 MSP430FR2476 Code Examples
        3. 4.5.3 MSP430 Application Notes and TI Designs
      6. 4.6 Community Resources
        1. 4.6.1 TI E2E Community
        2. 4.6.2 Community at Large
    6. 5 FAQ
    7. 6 Schematics

2.6 Using the eZ-FET Debug Probe With a Different Target

The eZ-FET debug probe on the LaunchPad development kit can interface to most MSP430 MCUs, not just the onboard MSP430FR2476 target device.

To interface to another MCU, disconnect all jumpers in the isolation jumper block. This is necessary because the debug probe cannot connect to more than one target at a time over the Spy-Bi-Wire (SBW) connection.

Next, make sure the target board has proper connections for SBW. To be compatible with SBW, the capacitor on RST/SBWTDIO must be 2.2 nF or less. For documentation on designing MSP430 JTAG interface circuitry, see the MSP430 Hardware Tools User's Guide.

Finally, wire together the following signals from the debug probe side of the isolation jumper block to the target hardware:

  • 5 V (if 5 V is needed)
  • 3.3 V
  • GND
  • SBWTDIO
  • SBWTCK
  • TXD (if the UART backchannel is to be used)
  • RXD (if the UART backchannel is to be used)

This wiring can be done either with jumper wires or by designing the board with a connector that plugs into the isolation jumper block.