SLVUCI0 May   2022 TPS274C65

 

  1.   Abstract
  2.   Trademarks
  3. 1Introduction
  4. 2Compatibility Across Silicon Versions
  5. 3BoosterPack™ Plug-in Module Operation
  6. 4TPS274C65EVM Schematic
  7. 5Connection Descriptions
  8. 6TPS274C65EVM Assembly Drawings and Layout
  9. 7Bill of Materials

Introduction

The Texas Instruments TPS274C65EVM is an evaluation module that is used to demonstrate and showcase all of the features of the underlying TPS274C65AS and TPS274C65BS industrial high side switch. This evaluation board provides a seamless way to connect a set of power supplies to the inputs of the TPS274C65, connect loads to the output channels, and switch on and off the device through SPI communication. An on-board 3.3-V buck-converter LMR36506 is included on the EVM to showcase the use of external VDD. Additionally this EVM includes BoosterPack plug-in module headers allowing the user to easily connect the TPS274C65 high side switch to either external microcontroller with jumper wires or a Texas Instruments microcontroller and write software to control and configure the device through SPI communication.

Features of the TPS274C65EVM include:

  • BoosterPack plug-in module pins for SPI communication
  • On-board 3.3-V buck-converter allowing for external VDD and lower device Iq
  • Ability to support versions AS and BS of the TPS274C65
  • On-board DIP switches for addressable SPI address configurations
  • Analog sensing configuration with potentiometer or fixed resistor
  • On-board LEDs to demostrate LED driving capabilities (AS version)
  • On-board Reverse Current Blocking (RCB) FETs to demostrate reverse current blocking driver functionality (AS version)