SLVUCN6 February   2023 TPS274C65

 

  1.   Abstract
  2. 1Description
  3. 2Get Started
  4. 3Features
  5. 4Applications
  6. 5Introduction
  7. 6TPS274C65 Configurator Software
    1. 6.1 Software Usage
    2. 6.2 Header File
  8. 7Hardware Design Files
    1. 7.1 Schematics
    2. 7.2 PCB Layouts
  9. 8Bill of Materials (BOM)
  10. 9Additional Information
    1. 9.1 Trademarks

Introduction

The TPS274C65USBEVM is an application level evaluation module made to showcase the powerful power delivery features of the TPS274C65 industrial high-side switch. The TPS274C65USBEVM is meant to mimic a real-world industrial end-application and thus comes with features such as an integrated TM4C ARM Cortex-M4F microcontroller, digital isolation, multiple high-side switches connected to the MCU via SPI, and compact layout design with limited test-points. In addition to the hardware EVM, a software package of both the firmware running on the TM4C microcontroller (written in embedded C) and a host GUI with source code are provided to be used as a reference in the end application.

Features include:

  • 2 x TPS274C65 65mΩ quad-channel industrial high-side switches placed in "addressable SPI" configuration
    • Provides 8x total independent output channels with parallel configurations supported
    • Adjustable current limit with special inrush duration control for capacitive charging
    • Integrated ADC allowing for high-accuracy reporting of current sense, FET temperature, and input/output voltage
  • Integrated TM4C123 ARM Cortex-M4F microcontroller with USB host interface
    • Plug-and-play operation using USB-HID with no need for customer driver installation
    • Pre-programmed firmware with no need for an external debugger
    • External programming of custom firmware possible via 10-pin ARM debugger
  • Full-featured and lightweight Windows host GUI for device configuration and monitoring
    • Ability to configure/change all register settings of both TPS274C65 devices including current limit, diagnostic configurations, etc.
    • Reporting/sensing of load current, FET temperature, and input/output voltage with active graphing
    • Fault monitoring and reporting for full array of fault conditions such as current limit, thermal faults, open load/wirebreak, etc.
  • Complete digital isolation from digital and high-current rails using the ISO7763DWR reinforced isolation device

GUID-20230104-SS0I-QRDK-K78C-F0XLBNCVJFHT-low.jpg Figure 5-1 Board Image