SLVUD74A
April 2025 – June 2025
1
Description
Get Started
Features
Applications
6
1
Evaluation Module Overview
1.1
Introduction
1.2
Kit Contents
1.3
Specification
1.4
Device Information
2
Hardware
2.1
Test Setup and Procedure
2.1.1
EVM Connections
2.1.2
Test Equipment
2.1.3
Recommended Test Setup
2.1.3.1
Input Connections
2.1.3.2
Output Connections
2.1.3.3
I2C Connections
2.1.4
Test Procedure
2.1.4.1
Graphic User Interface (GUI)
2.1.4.1.1
Quick Overview
2.1.4.2
Basic Test Procedure
3
Implementation Results
3.1
Test Data and Performance Curves
3.1.1
Efficiency
3.1.2
Operating Waveforms
3.1.2.1
Start-Up and Shutdown
3.1.2.2
Switching
3.1.2.3
Load Transient (CV), ISET Modulation (CC)
3.1.3
Thermal Performance
3.1.4
EMI Performance
4
Hardware Design Files
4.1
Schematic
4.2
PCB Layout
4.3
Bill of Materials
5
Additional Information
5.1
Trademarks
6
Device and Documentation Support
6.1
Device Support
6.1.1
Development Support
6.2
Documentation Support
6.2.1
Related Documentation
6.2.1.1
PCB Layout Resources
6.2.1.2
Thermal Design Resources
7
Revision History
4.2
PCB Layout
LM72880QEVM-400 uses a 6-layer PCB with 2oz copper thickness.
Figure 4-2
Top Components (Top View)
Figure 4-3
Bottom Components (Bottom View)
Figure 4-4
Top Layer Copper (Top View)
Figure 4-5
Layer 2 Copper (Top View)
Figure 4-6
Layer 3 Copper (Top View)
Figure 4-7
Layer 4 Copper (Top View)
Figure 4-8
Layer 5 Copper (Top View)
Figure 4-9
Bottom Copper (Bottom View)