SLVUDA3 July   2025

 

  1.   1
  2.   Description
  3.   Features
  4. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  5. 2Hardware
    1. 2.1 Hardware Features
      1. 2.1.1 MSPM0G3507 MCU
      2. 2.1.2 Application (or Backchannel) UART
      3. 2.1.3 Using an External Debug Probe
    2. 2.2 Power
    3. 2.3 Clocking
    4. 2.4 Pinout
  6. 3Hardware Design Files
    1. 3.1 Hardware Design Files
    2. 3.2 PCB Layouts
    3. 3.3 Bill of Materials (BOM)
  7. 4Software Examples
  8. 5Resources
    1. 5.1 Integrated Development Environments
      1. 5.1.1 TI Cloud Development Tools
      2. 5.1.2 TI Resource Explorer Cloud
      3. 5.1.3 Code Composer Studio Cloud
      4. 5.1.4 Code Composer Studio IDE
    2. 5.2 MSPM0 SDK and TI Resource Explorer
    3. 5.3 Community Resources
      1. 5.3.1 TI E2E Forums
  9. 6Additional Information
    1. 6.1 Trademarks
  10. 7Revision History

5.1.1 TI Cloud Development Tools

TI’s Cloud-based software development tools provide instant access to MSPM0 SDK content and a web-based IDE.