SLVUDB4 September   2025

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 Connector, Jumper, DIP switch and Test point Description
      1. 2.1.1 Connector Descriptions
      2. 2.1.2 Jumper Descriptions
      3. 2.1.3 DIP Switch Descriptions
      4. 2.1.4 Test Points Description
      5. 2.1.5 Easy to Use Features
  9. 3Implementation Results
    1. 3.1 Test Setup and Procedure
      1. 3.1.1 Test Setup
      2. 3.1.2 Configurations for Stacking Two EVMs
      3. 3.1.3 Test Procedure
      4. 3.1.4 Precautions
    2. 3.2 Performance Data and Results
      1. 3.2.1 Efficiency
      2. 3.2.2 Steady State Waveforms
      3. 3.2.3 Step Load Response
      4. 3.2.4 AC Loop Response Curve
      5. 3.2.5 Thermal Performance
  10. 4Hardware Design Files
    1. 4.1 Schematic
    2. 4.2 PCB Layers
    3. 4.3 Bill of Materials
  11. 5Additional Information
    1.     Trademarks

2.1.4 Test Points Description

Table 2-6 Test Points Description
Test PointNameDescription
TP1SW1Test point for switch node of phase 1
TP2SW2Test point for switch node of phase 2
TP3GNDTest point for GND
TP4GNDTest point for GND
TP5GNDTest point for GND