SNIA043A july   2021  – april 2023 TMP114 , TMP144

 

  1.   Abstract
  2.   Trademarks
  3. 1Introduction
  4. 2Heat Sink Temperature Sensor Monitoring
  5. 3Component Temperature Monitoring With Adjacent PCB Placement
  6. 4Under-Component Temperature Monitoring
    1. 4.1 Ultra-Thin Temperature Sensors
    2. 4.2 Designing an Under-Component Layout With the TMP114 Temperature Sensor
    3. 4.3 Under-Component Experimental Results
  7. 5Summary
  8. 6References
  9. 7Revision History

Summary

High accuracy component temperature monitoring is essential in both applications where temperature compensation is needed, or where a system requires safety shutoff limits. This type of component specific temperature monitoring can be done very well with an ultra-thin integrated temperature sensor such as the TMP114 or TMP144 temperature sensors, which can be placed underneath a device to provide the closest possible proximity and by extension, the best temperature correlation.

This style of design can respond more quickly to sudden temperature changes than a heat sink mounted sensor, and returns more accurate results than a sensor placed adjacent to the device to be monitored. Under-component temperature monitoring can be considered when the board layout is space-constrained and the component to be monitored has adequate clearance for the sensor.