SPRACL7 March 2019 AM5746 , AM5748 , AM5749
The environmental chamber used to collect this data circulates air internally to maintain homogeneous internal temperature, and does not accurately simulate the environment on the bench or end product. This is important to consider in passive cooling applications where air circulation can significantly impact PCB, package, and heatsink power dissipation efficiency.
The data presented in this test is gathered with a typical device, representing nominal silicon process and leakage. Thermal performance and power consumption can vary significantly due to process variation. Extra margin must be designed in to account for worst case process variation (leakage).