SPRACY2 May   2021 TMUX646

 

  1.   Trademarks
  2. 1Small Body nFBGA Package Details
  3. 2PCB Design Guidelines
  4. 3Packaging Tape and Reel
  5. 4Thermal Modeling
  6. 5Board Level Reliability
  7.   A Frequently Asked Questions
    1.     A.1 Small Body nFBGA Package Questions
  8.   B Package Data Sheets

5 Board Level Reliability

There is little difference between the structure of TIs standard and small body nFBGAs. However, small body nFBGA are subjected to rigorous reliability testing to ensure that the minor design differences do not impact reliability, especially BLR. Table 5-1 shows some of the BLR temperature cycle results for some of TI’s small body nFBGA packages

Table 5-1 BLR Temperature Cycle Results
Conditions (With Solder Paste) Failures/Sample Size
Requirements Extended Range
Package TI Mfg. Site Body Pitch Die Temp. 500 800 1000 1500 2000 2500 3000
Test Site (mm) (mm) (mm) Cycle
(°C)		 (Cycles) (Cycles)
ZWA 11 balls TIPI 2 x 1.4 0.5 1.0x0.6 -40/85 0/33 0/33 0/33 0/33 0/33 0/33 0/33
ZEC 36 balls TIPI 2.45 x 2.45 0.4 1.6x0.8 -40/125 TBD TBD TBD TBD TBD TBD TBD