SPRUJ97 June   2024

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 Key Features and Interfaces
    2. 2.2 EVM Compatibility
    3. 2.3 Assembly Instructions
    4. 2.4 Power Budget Considerations
    5. 2.5 Interfaces
      1. 2.5.1 EVM Interface
      2. 2.5.2 Sensor Interface / Coax
      3. 2.5.3 Sensor Interface / Twisted Pair
    6. 2.6 Circuit Details
      1. 2.6.1 Interface Mapping
      2. 2.6.2 I2C Address Map
      3. 2.6.3 GPIO Map
      4. 2.6.4 Identification EEPROM
  9. 3Hardware Design Files
    1. 3.1 Schematics
    2. 3.2 PCB Layouts
    3. 3.3 Bill of Materials (BOM)
  10. 4Compliance Information
    1. 4.1 Thermal Compliance
    2. 4.2 EMC, EMI, and ESD Compliance
  11. 5Additional Information
    1. 5.1 Known Hardware or Software Issues
    2. 5.2 Trademarks
  12. 6Related Documentation

4.2 EMC, EMI, and ESD Compliance

Components installed on the product are sensitive to Electrostatic Discharge (ESD). TI recommends this product be used in an ESD controlled environment. This can include a temperature and/or humidity-controlled environment to limit the buildup of ESD. TI also recommends to use ESD protection such as wrist straps and ESD mats when interfacing with the product.

The product is used in the basic electromagnetic environment as in laboratory condition and the applied standard is as per ENC IEC 61326-1:2021.