SWRZ099B April   2020  – March 2022 AWR6843AOP

 

  1. 1Introduction
  2. 2Device Nomenclature
  3. 3Device Markings
  4. 4Usage Notes
    1. 4.1 MSS: SPI Speed in 3-Wire Mode Usage Note
  5. 5Advisory to Silicon Variant / Revision Map
  6. 6Known Design Exceptions to Functional Specifications
    1.     MSS#25
    2.     MSS#26
    3.     MSS#27
    4.     MSS#28
    5.     MSS#29
    6.     MSS#30
    7.     MSS#31
    8.     MSS#32
    9.     MSS#33
    10.     MSS#34
    11.     MSS#36
    12.     MSS#37B
    13.     MSS#38A
    14.     MSS#39
    15.     MSS#40
    16.     MSS#41
    17.     MSS#42A
    18.     MSS#43A
    19.     MSS#44A
    20.     MSS#45
    21. 6.1 MSS#50
    22. 6.2 MSS#51
    23.     ANA#11B
    24.     ANA#12A
    25.     ANA#13B
    26.     ANA#14
    27.     ANA#16
    28.     ANA#17A
    29.     ANA#18B
    30.     ANA#19
    31.     ANA#20
    32.     ANA#22A
    33.     ANA#27A
    34.     ANA#30
    35.     ANA#31
    36.     PACKAGE#02
  7. 7Trademarks
  8. 8Revision History

PACKAGE#02

Surface Wave Artifact from PCB

Revisions Affected

AWR6843AOP ES2.0

Description:

Large PCBs area around the E-plane causes surface waves that create large ripples in the elevation direction of the AoP antenna radiation pattern.

GUID-20210415-CA0I-QMNM-4KQB-RZL60NWR7KDN-low.png

Workaround #1

Keep the Edge of PCB close to the edge of the AoP device in the E-plane to minimize the surface wave ripples.

GUID-20210415-CA0I-VB8L-WPXZ-VBH1XNFSLJD5-low.png Figure 6-1 Small form factor board with PCB edge less than 0.3mm

Workaround #2

If a larger board is needed for the solution, a trapezoid cutout with the PCB edge less than <0.3mm from the edge of the AoP should be implemented to minimize the ripples caused by surface waves.

GUID-20210415-CA0I-8SMX-BWT8-H837KVTTFHHQ-low.png Figure 6-2 Large form factor board with trapezoidal cutout and PCB edge less than 0.3mm