DLPS294A September   2025  – November 2025 DLP78TUV

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Storage Conditions
    3. 5.3  ESD Ratings
    4. 5.4  Recommended Operating Conditions
    5.     11
    6. 5.5  Thermal Information
    7. 5.6  Electrical Characteristics
    8. 5.7  Timing Requirements
    9.     15
    10. 5.8  System Mounting Interface Loads
    11.     17
    12. 5.9  Micromirror Array Physical Characteristics
    13.     19
    14. 5.10 Micromirror Array Optical Characteristics
    15.     21
    16. 5.11 Window Characteristics
    17. 5.12 Chipset Component Usage Specification
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Power Interface
      2. 6.3.2 Timing
    4. 6.4 Device Functional Modes
    5. 6.5 Optical Interface and System Image Quality Considerations
      1. 6.5.1 Numerical Aperture and Stray Light Control
      2. 6.5.2 Pupil Match
      3. 6.5.3 Illumination Overfill
    6. 6.6 Micromirror Array Temperature Calculation
    7. 6.7 Micromirror Power Density Calculation
    8. 6.8 Window Aperture Illumination Overfill Calculation
    9. 6.9 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 6.9.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 6.9.2 Landed Duty Cycle and Useful Life of the DMD
      3. 6.9.3 Landed Duty Cycle and Operational DMD Temperature
      4. 6.9.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Temperature Sensor Diode
    4. 7.4 Power Supply Recommendations
      1. 7.4.1 DMD Power Supply Requirements
      2. 7.4.2 DMD Power Supply Power-Up Procedure
      3. 7.4.3 DMD Power Supply Power-Down Procedure
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
        1. 7.5.2.1 Layers
        2. 7.5.2.2 Impedance Requirements
        3. 7.5.2.3 Trace Width, Spacing
          1. 7.5.2.3.1 Voltage Signals
  9. Device and Documentation Support
    1. 8.1 Third-Party Products Disclaimer
    2. 8.2 Device Support
      1. 8.2.1 Device Nomenclature
    3. 8.3 Device Markings
    4. 8.4 Documentation Support
      1. 8.4.1 Related Documentation
    5. 8.5 Receiving Notification of Documentation Updates
    6. 8.6 Support Resources
    7. 8.7 Trademarks
    8. 8.8 Electrostatic Discharge Caution
    9. 8.9 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Timing Requirements

Over Recommended Operating Conditions (unless otherwise noted)
PARAMETER DESCRIPTIONMINNOMMAXUNIT
SCP
tSCP_DSSCPDI clock setup time (before SCPCLK falling-edge)(1)800ns
tSCP_DHSCPDI hold time (after SCPCLK falling-edge)(1)900ns
tSCP_NEG_ENZTime between falling edge of SCPENZ and the rising edge of SCPCLK(1)1µs
tSCP_POS_ENZTime between falling edge of SCPCLK and the rising edge of SCPENZ(1)1µs
tSCP_OUT_ENTime required for SCP output buffer to recover after SCPENZ (from tri-state).(1)960ns
tSCP_PW_ENZSCPENZ inactive pulse width (high-level)11/Fscpclk
trRise time (20% to 80%). See (2)200ns
tfFall time (80% to 20%). See (2)200ns
LVDS
tR_LVDSRise time (20% to 80%). See (3)500ps
tF_LVDSFall time (80% to 20%). See (3)500ps
tCClock Cycle Duration for DCLK_C and DCLK_D(4)2.5ns
tWPulse Duration for DCLK_C/D(4)1.19ns
tSU_dataSetup Time for High-speed data(15:0) before DCLK(4)350ps
tSU_sctrlSetup Time for SCTRL before DCLK(4)330ps
tH_dataHold time for High-speed data(15:0) after DCLK(4)150ps
tH_sctrlHold Time for SCTRL after DCLK(4)170ps
tSKEW_A2BSkew tolerance between Channel B and Channel A(6)(7)(8)-1.251.25ns
tSKEW_C2D Skew tolerance between Channel C and Channel D(5)(9)(10) –1.25 1.25 ns
See Figure 5-3.
See Figure 5-4.
See Figure 5-6.
See Figure 5-7.
See Figure 5-8.
See Figure 5-8.
Channel A (Bus A) includes the following LVDS pairs: DCLK_A, SCTRL_A, and D_A.
Channel B (Bus B) includes the following LVDS pairs: DCLK_B, SCTRL_B, and D_B.
Channel C (Bus C) includes the following LVDS pairs: DCLK_C, SCTRL_C, and D_C
Channel D (Bus D) includes the following LVDS pairs: DCLK_D, SCTRL_D, and D_D.